SLOSE50A April   2020  – June 2021

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
      1. 6.5.1 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Bridge Control
      2. 7.3.2 Current Regulation
      3. 7.3.3 Decay Modes
        1. 7.3.3.1 Mixed Decay
        2. 7.3.3.2 Fast Decay
        3. 7.3.3.3 Smart tune Dynamic Decay
        4. 7.3.3.4 Smart tune Ripple Control
        5. 7.3.3.5 Blanking time
      4. 7.3.4 Charge Pump
      5. 7.3.5 Linear Voltage Regulators
      6. 7.3.6 Logic and Quad-Level Pin Diagrams
        1. 7.3.6.1 nFAULT Pin
      7. 7.3.7 Protection Circuits
        1. 7.3.7.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.7.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.7.3 Overcurrent Protection (OCP)
        4. 7.3.7.4 Thermal Shutdown (OTSD)
        5.       Fault Condition Summary
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Operating Mode (nSLEEP = 1)
      3. 7.4.3 nSLEEP Reset Pulse
      4.      Functional Modes Summary
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Current Regulation
          1. 8.2.2.1.1 Power Dissipation and Thermal Calculation
          2. 8.2.2.1.2 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.