SLVSHB2 February   2024 DRV8262-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
      1. 5.4.1 Transient Thermal Impedance & Current Capability
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Feature Description
    4. 6.4  Device Operational Modes
      1. 6.4.1 Dual H-Bridge Mode (MODE1 = 0)
      2. 6.4.2 Single H-Bridge Mode (MODE1 = 1)
    5. 6.5  Current Sensing and Regulation
      1. 6.5.1 Current Sensing and Feedback
      2. 6.5.2 Current Regulation
        1. 6.5.2.1 Mixed Decay
        2. 6.5.2.2 Smart tune Dynamic Decay
      3. 6.5.3 Current Sensing with External Resistor
    6. 6.6  Charge Pump
    7. 6.7  Linear Voltage Regulator
    8. 6.8  VCC Voltage Supply
    9. 6.9  Logic Level, Tri-Level and Quad-Level Pin Diagrams
    10. 6.10 Protection Circuits
      1. 6.10.1 VM Undervoltage Lockout (UVLO)
      2. 6.10.2 VCP Undervoltage Lockout (CPUV)
      3. 6.10.3 Logic Supply Power on Reset (POR)
      4. 6.10.4 Overcurrent Protection (OCP)
      5. 6.10.5 Thermal Shutdown (OTSD)
      6. 6.10.6 nFAULT Output
      7. 6.10.7 Fault Condition Summary
    11. 6.11 Device Functional Modes
      1. 6.11.1 Sleep Mode
      2. 6.11.2 Operating Mode
      3. 6.11.3 nSLEEP Reset Pulse
      4. 6.11.4 Functional Modes Summary
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving Brushed-DC Motors
        1. 7.1.1.1 Brushed-DC Motor Driver Typical Application
        2. 7.1.1.2 Power Loss Calculations - Dual H-bridge
        3. 7.1.1.3 Power Loss Calculations - Single H-bridge
        4. 7.1.1.4 Junction Temperature Estimation
        5. 7.1.1.5 Application Performance Plots
      2. 7.1.2 Driving Stepper Motors
        1. 7.1.2.1 Stepper Driver Typical Application
        2. 7.1.2.2 Power Loss Calculations
        3. 7.1.2.3 Junction Temperature Estimation
      3. 7.1.3 Driving Thermoelectric Coolers (TEC)
  9. 8 Package Thermal Considerations
    1. 8.1 DDW Package
      1. 8.1.1 Thermal Performance
        1. 8.1.1.1 Steady-State Thermal Performance
        2. 8.1.1.2 Transient Thermal Performance
    2. 8.2 PCB Material Recommendation
  10. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
    2. 9.2 Power Supplies
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5.3 Current Sensing with External Resistor

The IPROPI output accuracy is ±4% for 40% to 100% of rated current. If more accurate current sensing is desired, external sense resistors can also be used between the PGND pins and the system ground to sense the load currents, as shown below.

GUID-20230329-SS0I-04M0-Q56N-DLGT5SS5P93S-low.svgFigure 6-9 Current Sensing with External Resistor

The voltage drop across the external sense resistor should not exceed 300mV.

Place the sense resistors as close as possible to the corresponding IC pins. Use a symmetrical sense resistor layout to ensure good matching. Low-inductance sense resistors should be used to prevent voltage spikes and ringing. For optimal performance, the sense resistor should be a surface-mount resistor rated for high enough power. Because power resistors are larger and more expensive than standard resistors, it is common practice to use multiple standard resistors in parallel. This distributes the current and heat dissipation.