SLVSE39B November 2017 – July 2018 DRV8304
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | DRV8304 | UNIT | |
---|---|---|---|
RHA (VQFN) | |||
32 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 35.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 22.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 14.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 14.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.7 | °C/W |