SLVSCF7B February   2014  – November 2017 DRV8308

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Hall Comparators
      2. 7.3.2  FG Amplifier, Comparator, and FG Output
      3. 7.3.3  Enable, Reset, and Clock Generation
      4. 7.3.4  Commutation
        1. 7.3.4.1 120° 3-Hall Commutation
        2. 7.3.4.2 120° Single-Hall Commutation
        3. 7.3.4.3 180° Sine-Wave-Drive Commutation
      5. 7.3.5  Commutation Logic Block Diagram
      6. 7.3.6  Commutation Parameters
      7. 7.3.7  Braking
      8. 7.3.8  Output Pre-Drivers
      9. 7.3.9  Current Limit
      10. 7.3.10 Charge Pump
      11. 7.3.11 5-V Linear Regulator
      12. 7.3.12 Power Switch
      13. 7.3.13 Protection Circuits
        1. 7.3.13.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.13.2 VM Overvoltage (VMOV)
        3. 7.3.13.3 Motor Overcurrent (OCP)
        4. 7.3.13.4 Charge Pump Failure (CPFAIL)
        5. 7.3.13.5 Charge Pump Short (CPSC)
        6. 7.3.13.6 Overtemperature (OTS)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Speed Input
        1. 7.4.1.1 Clock Frequency Mode
        2. 7.4.1.2 Clock PWM and Internal Register PWM Modes
      2. 7.4.2 Auto Gain and Advance Compensation
      3. 7.4.3 External EEPROM Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Serial Data Format
      3. 7.5.3 Programming the OTP Configuration Memory
    6. 7.6 Register Map
      1. 7.6.1 Control Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Internal Speed Control Loop Constraints
      2. 8.1.2 Hall Sensor Configurations and Connections
      3. 8.1.3 FG Amplifier Configurations and Connections
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Motor voltage
        2. 8.2.2.2 Motor Current (Peak and RMS)
        3. 8.2.2.3 Speed Command Method
        4. 8.2.2.4 Required Flutter (Speed Jitter)
        5. 8.2.2.5 Configuration Method
        6. 8.2.2.6 Hall Element Current
        7. 8.2.2.7 Power FET Switching Time
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
      1. 8.3.1 RESET and ENABLE Considerations
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.