SLVSGK9 January   2022 DRV8316-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings AUTO
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Requirements
    7. 7.7 SPI Slave Mode Timings
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Output Stage
      2. 8.3.2  Control Modes
        1. 8.3.2.1 6x PWM Mode (MODE = 00b or MODE Pin Tied to AGND)
        2. 8.3.2.2 3x PWM Mode (MODE = 10b or MODE Pin is Connected to AGND with RMODE)
        3. 8.3.2.3 Current Limit Mode (MODE = 01b / 11b or MODE Pin is Hi-Z or Connected to AVDD)
      3. 8.3.3  Device Interface Modes
        1. 8.3.3.1 Serial Peripheral Interface (SPI)
        2. 8.3.3.2 Hardware Interface
      4. 8.3.4  Step-Down Mixed-Mode Buck Regulator
        1. 8.3.4.1 Buck in Inductor Mode
        2. 8.3.4.2 Buck in Resistor mode
        3. 8.3.4.3 Buck Regulator with External LDO
        4. 8.3.4.4 AVDD Power Sequencing on Buck Regulator
        5. 8.3.4.5 Mixed mode Buck Operation and Control
        6. 8.3.4.6 Buck Undervoltage Protection
        7. 8.3.4.7 Buck Overcurrent Protection
      5. 8.3.5  AVDD Linear Voltage Regulator
      6. 8.3.6  Charge Pump
      7. 8.3.7  Slew Rate Control
      8. 8.3.8  Cross Conduction (Dead Time)
      9. 8.3.9  Propagation Delay
        1. 8.3.9.1 Driver Delay Compensation
      10. 8.3.10 Pin Diagrams
        1. 8.3.10.1 Logic Level Input Pin (Internal Pulldown)
        2. 8.3.10.2 Logic Level Input Pin (Internal Pullup)
        3. 8.3.10.3 Open Drain Pin
        4. 8.3.10.4 Push Pull Pin
        5. 8.3.10.5 Four Level Input Pin
      11. 8.3.11 Current Sense Amplifiers
        1. 8.3.11.1 Current Sense Amplifier Operation
      12. 8.3.12 Current Sense Amplifier Offset Correction
      13. 8.3.13 Active Demagnetization
        1. 8.3.13.1 Automatic Synchronous Rectification Mode (ASR Mode)
          1. 8.3.13.1.1 Automatic Synchronous Rectification in Commutation
          2. 8.3.13.1.2 Automatic Synchronous Rectification in PWM Mode
        2. 8.3.13.2 Automatic Asynchronous Rectification Mode (AAR Mode)
      14. 8.3.14 Cycle-by-Cycle Current Limit
        1. 8.3.14.1 Cycle by Cycle Current Limit with 100% Duty Cycle Input
      15. 8.3.15 Protections
        1. 8.3.15.1 VM Supply Undervoltage Lockout (NPOR)
        2. 8.3.15.2 AVDD Undervoltage Lockout (AVDD_UV)
        3. 8.3.15.3 BUCK Undervoltage Lockout (BUCK_UV)
        4. 8.3.15.4 VCP Charge Pump Undervoltage Lockout (CPUV)
        5. 8.3.15.5 Overvoltage Protections (OV)
        6. 8.3.15.6 Overcurrent Protection (OCP)
          1. 8.3.15.6.1 OCP Latched Shutdown (OCP_MODE = 00b)
          2. 8.3.15.6.2 OCP Automatic Retry (OCP_MODE = 01b)
          3. 8.3.15.6.3 OCP Report Only (OCP_MODE = 10b)
          4. 8.3.15.6.4 OCP Disabled (OCP_MODE = 11b)
        7. 8.3.15.7 Buck Overcurrent Protection
        8. 8.3.15.8 Thermal Warning (OTW)
        9. 8.3.15.9 Thermal Shutdown (OTS)
          1. 8.3.15.9.1 OTS FET
          2. 8.3.15.9.2 OTS (Non FET)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Functional Modes
        1. 8.4.1.1 Sleep Mode
        2. 8.4.1.2 Operating Mode
        3. 8.4.1.3 Fault Reset (CLR_FLT or nSLEEP Reset Pulse)
      2. 8.4.2 DRVOFF functionality
    5. 8.5 SPI Communication
      1. 8.5.1 Programming
        1. 8.5.1.1 SPI Format
    6. 8.6 Register Map
      1. 8.6.1 STATUS Registers
      2. 8.6.2 CONTROL Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Three-Phase Brushless-DC Motor Control
        1. 9.2.1.1 Detailed Design Procedure
          1. 9.2.1.1.1 Motor Voltage
          2. 9.2.1.1.2 Using Active Demagnetization
          3. 9.2.1.1.3 Driver Propagation Delay and Dead Time
          4. 9.2.1.1.4 Using Delay Compensation
          5. 9.2.1.1.5 Using the Buck Regulator
          6. 9.2.1.1.6 Current Sensing and Output Filtering
          7. 9.2.1.1.7 Power Dissipation and Junction Temperature Losses
        2. 9.2.1.2 Application Curves
      2. 9.2.2 Three-Phase Brushless-DC Motor Control With Current Limit
        1. 9.2.2.1 Block Diagram
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Motor Voltage
          2. 9.2.2.2.2 ILIM Implementation
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Brushed-DC and Solenoid Load
        1. 9.2.3.1 Block Diagram
        2. 9.2.3.2 Design Requirements
          1. 9.2.3.2.1 Detailed Design Procedure
      4. 9.2.4 Three Solenoid Loads
        1. 9.2.4.1 Block Diagram
        2. 9.2.4.2 Design Requirements
          1. 9.2.4.2.1 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 Support Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

Figure 6-1 DRV8316R-Q140-Pin VQFN With Exposed Thermal PadTop View
Figure 6-2 DRV8316T-Q140-Pin VQFN With Exposed Thermal PadTop View
Table 6-1 Pin Functions
PIN 40-pin Package TYPE(1) DESCRIPTION
NAME DRV8316R-Q1 DRV8316T-Q1
AGND 2, 26 2, 26 GND Device analog ground. Refer Section 11.1 for connections recommendation.
AVDD 25 25 PWR O 3.3-V internal regulator output. Connect an X5R or X7R, 1-µF, 6.3-V ceramic capacitor between the AVDD and AGND pins. This regulator can source up to 30 mA externally.
CP 8 8 PWR O Charge pump output. Connect a X5R or X7R, 1-µF, 16-V ceramic capacitor between the CP and VM pins.
CPH 7 7 PWR Charge pump switching node. Connect a X5R or X7R, 47-nF, ceramic capacitor between the CPH and CPL pins. TI recommends a capacitor voltage rating at least twice the normal operating voltage of the device.
CPL 6 6 PWR
DRVOFF 21 21 I When this pin is pulled high the six MOSFETs in the power stage are turned OFF making all outputs Hi-Z.
FB_BK 3 3 PWR I Feedback for buck regulator. Connect to buck regulator output after the inductor/resistor.
GAIN — 36 I Amplifier gain setting. The pin is a 4 level input pin set by an external resistor.
GND_BK 4 4 GND Buck regulator ground. Refer Section 11.1 for connections recommendation.
INHA 27 27 I High-side driver control input for OUTA. This pin controls the output of the high-side MOSFET.
INHB 29 29 I High-side driver control input for OUTB. This pin controls the output of the high-side MOSFET.
INHC 31 31 I High-side driver control input for OUTC. This pin controls the output of the high-side MOSFET.
INLA 28 28 I Low-side driver control input for OUTA. This pin controls the output of the low-side MOSFET.
INLB 30 30 I Low-side driver control input for OUTB. This pin controls the output of the low-side MOSFET.
INLC 32 32 I Low-side driver control input for OUTC. This pin controls the output of the low-side MOSFET.
MODE — 33 I PWM input mode setting. This pin is a 2-level input pin set by an external resistor.
NC 1, 24 1 — No connection, open
nFAULT 22 22 O Fault indicator. Pulled logic-low with fault condition; Open-drain output requires an external pull-up resistor to 1.8V to 5.0 V. If external supply is used to pull up nFAULT, ensure that it is pulled to >2.2 V on power up or the device will enter test mode
nSCS 36 — I Serial chip select. A logic low on this pin enables serial interface communication.
nSLEEP 23 23 I Driver nSLEEP. When this pin is logic low, the device goes into a low-power sleep mode. An 20 to 40-µs low pulse can be used to reset fault conditions without entering sleep mode.
OCP — 35 I OCP level setting. This pin is a 2 level input pin set by an external resistor (Hardware devices).
OUTA 13, 14 13, 14 PWR O Half bridge output A
OUTB 16, 17 16, 17 PWR O Half bridge output B
OUTC 19, 20 19, 20 PWR O Half bridge output C
PGND 12, 15, 18 12, 15, 18 GND Device power ground. Refer Section 11.1 for connections recommendation.
SCLK 35 — I Serial clock input. Serial data is shifted out and captured on the corresponding rising and falling edge on this pin (SPI devices).
SDI 34 — I Serial data input. Data is captured on the falling edge of the SCLK pin (SPI devices).
SDO 33 — O Serial data output. Data is shifted out on the rising edge of the SCLK pin. This pin requires an external pullup resistor (SPI devices).
SLEW — 34 I Slew rate control setting. This pin is a 4-level input pin set by an external resistor.
SOA 40 40 O Current sense amplifier output.
SOB 39 39 O Current sense amplifier output.
SOC 38 38 O Current sense amplifier output.
SW_BK 5 5 PWR O Buck switch node. Connect this pin to an inductor or resistor.
VM 9, 10, 11 9, 10, 11 PWR I Power supply. Connect to motor supply voltage; bypass to PGND with two 0.1-µF capacitors (for each pin) plus one bulk capacitor rated for VM. TI recommends a capacitor voltage rating at least twice the normal operating voltage of the device.
VSEL_BK — 24 I Buck output voltage setting. This pin is a 4-level input pin set by an external resistor.
VREF/ILIM 37 37 PWR/I VREF in PWM Mode 1 and Mode 3: Current sense amplifier power supply input and reference. Connect a X5R or X7R, 0.1-µF, 6.3-V ceramic capacitor between the VREF and AGND pins.
ILIM in PWM Mode 2 and Mode4: Sets the threshold for phase current used in cycle by cycle current limit.
Thermal pad GND Must be connected to analog ground.
(1) I = input, O = output, GND = ground pin, PWR = power, NC = no connect