SLVSHC7 December   2023 DRV8334

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions 48-Pin DRV8334
  7. 6 Specification
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings DRV8334
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information DRV8334
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 SPI Timing Diagrams
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Three BLDC Gate Drivers
        1. 7.3.1.1 PWM Control Modes
          1. 7.3.1.1.1 6x PWM Mode
          2. 7.3.1.1.2 3x PWM Mode with INLx enable control
          3. 7.3.1.1.3 3x PWM Mode with SPI enable control
          4. 7.3.1.1.4 1x PWM Mode
          5. 7.3.1.1.5 SPI Gate Drive Mode
        2. 7.3.1.2 Gate Drive Architecture
          1. 7.3.1.2.1 Bootstrap diode
          2. 7.3.1.2.2 GVDD Charge pump
          3. 7.3.1.2.3 VCP Trickle Charge pump
          4. 7.3.1.2.4 Gate Driver Output
          5. 7.3.1.2.5 Passive and Semi-active pull-down resistor
          6. 7.3.1.2.6 TDRIVE Gate Drive Timing Control
          7. 7.3.1.2.7 Propagation Delay
          8. 7.3.1.2.8 Deadtime and Cross-Conduction Prevention
      2. 7.3.2 Low-Side Current Sense Amplifiers
        1. 7.3.2.1 Unidirectional Current Sense Operation
        2. 7.3.2.2 Bidirectional Current Sense Operation
      3. 7.3.3 Gate Driver Shutdown
        1. 7.3.3.1 DRVOFF Gate Driver Shutdown
        2. 7.3.3.2 Gate Driver Shutdown Timing Sequence
      4. 7.3.4 Gate Driver Protective Circuits
        1. 7.3.4.1  PVDD Supply Undervoltage Lockout (PVDD_UV)
        2. 7.3.4.2  GVDD Undervoltage Lockout (GVDD_UV)
        3. 7.3.4.3  BST Undervoltage Lockout (BST_UV)
        4. 7.3.4.4  MOSFET VDS Overcurrent Protection (VDS_OCP)
        5. 7.3.4.5  VSENSE Overcurrent Protection (SEN_OCP)
        6. 7.3.4.6  Phase Comparators
        7. 7.3.4.7  Thermal Shutdown (OTSD)
        8. 7.3.4.8  Thermal Warning (OTW)
        9. 7.3.4.9  OTP CRC
        10. 7.3.4.10 SPI Watchdog Timer
    4. 7.4 Device Functional Modes
      1. 7.4.1 Gate Driver Functional Modes
        1. 7.4.1.1 Sleep Mode
        2. 7.4.1.2 Operating Mode
      2. 7.4.2 Device Power Up Sequence
    5. 7.5 Programming
      1. 7.5.1 SPI
      2. 7.5.2 SPI Format
      3. 7.5.3 SPI Format Diagrams
    6. 7.6 Register Maps
      1. 7.6.1 STATUS Registers
      2. 7.6.2 CONTROL Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application with 48-pin package
        1. 8.2.1.1 External Components
      2. 8.2.2 Application Curves
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1.1 External Components

External components lists the recommended external components.

Table 8-1 External Components (48-pin Package)
COMPONENT PIN1 PIN2 RECOMMENDED
RPVDD VBAT PVDD OPTIONAL: 1-Ω (or smaller) series resistor
CPVDD PVDD GND 10-μF ceramic capacitor rated for PVDD.
CGVDD GVDD GND 10-μF ceramic capacitor rated for GVDD.
CCP_FLY CPH CPL 1.0-μF ceramic capacitor rated for GVDD voltage
CCPT_FLY CPTH CPTL 1.0-μF ceramic capacitor rated for GVDD voltage
CVCP VCP VDRAIN 1.0-μF ceramic capacitor rated for VCP voltage
RnFAULT VCCIO nFAULT 10 kΩ pulled up the MCU I/O power supply
CVREF VREF GND 0.1-μF ceramic capacitor rated for VREF
CBULK VMOTOR GND 100-μF - 1000-μF rated for VMOTOR; Depending on system configuration
CVDRAIN VDRAIN GND 1-μF rated for VDRAIN
CBST BSTx SHx 1.0-μF, 20-V ceramic capacitor between BSTx and SHx depending on the total gate charge of external MOSFET Qg. CBST > 40 X Qg / (VGHX-VSHx)
RBST BSTx SHx 3-Ω series resistor between BSTx and SHx to help prevent CBST from being overcharged if big negative transient voltage is observed on SHx pin.
RG GHx, GLx Gate of external MOSFET OPTIONAL: 2-Ω series resistor between GHx/GLx and Gate of external MOSFET.
RGS GHx, GLx Source of external MOSFET 100-kΩ pull down resistor between GHx/GLx and Source of external MOSFET.
RSENSE SPx SNx 0.5-mΩ Shunt resistor for current sense amplifier. System design parameter.
RSO MCU ADC SOx 160-Ω for current sense amplifier output filter
CSO MCU ADC GND 470-pF ceramic capacitor rated for AREF for current sense amplifier output filter
RSP, RSN SPx/SNx RSENSE OPTIONAL: 10-Ω for current sense amplifier input filter.
CSPSN SPx SNx OPTIONAL: 1-nF ceramic capacitor for current sense amplifier input filter.
CSP, CSN SPx/SNx GND OPTIONAL: 1-nF ceramic capacitor for current sense amplifier input filter.