SLVSFV1B August 2018 – August 2021 DRV8350F , DRV8353F
PRODUCTION DATA
Design care must be taken to make sure that the thermal ratings of the DRV835xF are not violated during normal operation of the device. The is especially critical in higher voltage and higher ambient operation applications where power dissipation or the device ambient temperature are increased.
To determine the temperature of the device in dual supply operation, first the internal power dissipation must be calculated. The internal power dissipation has three primary components:
The value of PVCP and PVGLS can be approximated by referring to Section 9.2.1.2.1 to first determine IVCP and IVGLS and then referring to Equation 36 and Equation 37.
The value of PVM can be calculated by referring to the datasheet parameter for IVM current and Equation 38.
The total power dissipation is then calculated by summing the four components as shown in Equation 39.
Lastly, the device junction temperature can be estimate by referring to the Section 7.4 and Equation 40.
Note that the information in the Section 7.4 is based off of a standardized test metric for package and PCB thermal dissipation. The actual values may vary based on the actual PCB design used in the application.