SLES242H December   2009  – July 2024 DRV8412

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Package Heat Dissipation Ratings
    6. 5.6 Package Power Deratings (DRV8412) #GUID-2A6DB468-D895-404F-A2E6-05A442AE2834/SLES2429141
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Error Reporting
      2. 6.3.2 Device Protection System
        1. 6.3.2.1 Bootstrap Capacitor Undervoltage Protection
        2. 6.3.2.2 Overcurrent (OC) Protection
        3. 6.3.2.3 Overtemperature Protection
        4. 6.3.2.4 Undervoltage Protection (UVP) and Power-On Reset (POR)
      3. 6.3.3 Device Reset
    4. 6.4 Device Functional Modes
  8.   Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Full Bridge Mode Operation
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Motor Voltage
          2. 7.2.1.2.2 Current Requirement of 12V Power Supply
          3. 7.2.1.2.3 Voltage of Decoupling Capacitor
          4. 7.2.1.2.4 Overcurrent Threshold
          5. 7.2.1.2.5 Sense Resistor
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Parallel Full Bridge Mode Operation
      3. 7.2.3 Stepper Motor Operation
      4. 7.2.4 TEC Driver
      5. 7.2.5 LED Lighting Driver
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
      2. 7.3.2 Power Supplies
      3. 7.3.3 System Power-Up and Power-Down Sequence
        1. 7.3.3.1 Powering Up
        2. 7.3.3.2 Powering Down
      4. 7.3.4 System Design Recommendations
        1. 7.3.4.1 VREG Pin
        2. 7.3.4.2 VDD Pin
        3. 7.3.4.3 OTW Pin
        4. 7.3.4.4 Mode Select Pin
        5. 7.3.4.5 Parallel Mode Operation
        6. 7.3.4.6 TEC Driver Application
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Material Recommendation
        2. 7.4.1.2 Ground Plane
        3. 7.4.1.3 Decoupling Capacitor
        4. 7.4.1.4 AGND
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Current Shunt Resistor
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 DRV8412 Thermal Via Design Recommendation
  9. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

DRV8412 DRV8432
Table 4-1 Pin Functions
PIN I/O TYPE (1) DESCRIPTION
NAME DRV8412 DRV8432
AGND 12 9 P Analog ground
BST_A 24 35 P High side bootstrap supply (BST), external capacitor to OUT_A required
BST_B 33 28 P High side bootstrap supply (BST), external capacitor to OUT_B required
BST_C 34 27 P High side bootstrap supply (BST), external capacitor to OUT_C required
BST_D 43 20 P High side bootstrap supply (BST), external capacitor to OUT_D required
GND 13 8 P Ground
GND_A 29 32 P Power ground for half-bridge A
GND_B 30 31 P Power ground for half-bridge B
GND_C 37 24 P Power ground for half-bridge C
GND_D 38 23 P Power ground for half-bridge D
GVDD_A 23 36 P Gate-drive voltage supply
GVDD_B 22 1 P Gate-drive voltage supply
GVDD_C 1 18 P Gate-drive voltage supply
GVDD_D 44 19 P Gate-drive voltage supply
M1 8 13 I Mode selection pin
M2 9 12 I Mode selection pin
M3 10 11 I Reserved mode selection pin, AGND connection is recommended
NC 3, 4, 19, 20, 25, 42 — — No connection pin. Ground connection is recommended
OC_ADJ 14 7 O Analog overcurrent programming pin, requires resistor to AGND
OTW 21 2 O Overtemperature warning signal, open-drain, active-low. An internal pullup resistor to VREG (3.3 V) is provided on output. Level compliance for 5-V logic can be obtained by adding external pullup resistor to 5 V
OUT_A 28 33 O Output, half-bridge A
OUT_B 31 30 O Output, half-bridge B
OUT_C 36 25 O Output, half-bridge C
OUT_D 39 22 O Output, half-bridge D
PVDD_A 26, 27 34 P Power supply input for half-bridge A requires close decoupling capacitor to ground.
PVDD_B 32 29 P Power supply input for half-bridge B requires close decoupling capacitor to gound.
PVDD_C 35 26 P Power supply input for half-bridge C requires close decoupling capacitor to ground.
PVDD_D 40, 41 21 P Power supply input for half-bridge D requires close decoupling capacitor to ground.
PWM_A 17 4 I Input signal for half-bridge A
PWM_B 15 6 I Input signal for half-bridge B
PWM_C 7 14 I Input signal for half-bridge C
PWM_D 5 16 I Input signal for half-bridge D
RESET_AB 16 5 I Reset signal for half-bridge A and half-bridge B, active-low
RESET_CD 6 15 I Reset signal for half-bridge C and half-bridge D, active-low
FAULT 18 3 O Fault signal, open-drain, active-low. An internal pullup resistor to VREG (3.3 V) is provided on output. Level compliance for 5-V logic can be obtained by adding external pullup resistor to 5 V
VDD 2 17 P Power supply for digital voltage regulator requires capacitor to ground for decoupling.
VREG 11 10 P Digital regulator supply filter pin requires 0.1-μF capacitor to AGND.
THERMAL PAD — N/A T Solder the exposed thermal pad to the landing pad on the pcb. Connect landing pad to bottom side of pcb through via for better thermal dissipation. This pad should be connected to GND.
HEAT SLUG N/A — T Mount heat sink with thermal interface on top of the heat slug for best thermal performance.
(1) I = input, O = output, P = power, T = thermal
Table 4-2 Mode Selection Pins
MODE PINS OUTPUT CONFIGURATION DESCRIPTION
M3 M2 M1
0 0 0 2 FB or 4 HB Dual full bridges (two PWM inputs each full bridge) or four half bridges with cycle-by-cycle current limit
0 0 1 2 FB or 4 HB Dual full bridges (two PWM inputs each full bridge) or four half bridges with OC latching shutdown (no cycle-by-cycle current limit)
0 1 0 1 PFB Parallel full bridge with cycle-by-cycle current limit
0 1 1 2 FB Dual full bridges (one PWM input each full bridge with complementary PWM on second half bridge) with cycle-by-cycle current limit
1 x x Reserved