SLVSHA4 June   2024 DRV8421

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings Comm
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 PWM Motor Drivers
      2. 7.3.2 Truth Tables
      3. 7.3.3 Parallel Operation
      4. 7.3.4 Protection Circuits
        1. 7.3.4.1 OCP
        2. 7.3.4.2 TSD
        3. 7.3.4.3 UVLO
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Bulk Capacitance Sizing
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Community Resources
    2. 9.2 Trademarks
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) DRV8421 UNIT
DFU (SSOP) DGQ (HVSSOP)
10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 105.6 62.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.5 80.5 °C/W
RθJB Junction-to-board thermal resistance 53.7 28.5 °C/W
ΨJT Junction-to-top characterization parameter 9.2 6.7 °C/W
ΨJB Junction-to-board characterization parameter 53.0 28.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 7.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.