SLOSE54C June   2020  – July 2022 DRV8428

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Indexer Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 RMS Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2 PWM Motor Drivers
      3. 7.3.3 Microstepping Indexer
      4. 7.3.4 Controlling VREF with an MCU DAC
      5. 7.3.5 Current Regulation, Off-time and Decay Modes
        1. 7.3.5.1 Mixed Decay
        2. 7.3.5.2 Smart tune Dynamic Decay
        3. 7.3.5.3 Smart tune Ripple Control
        4. 7.3.5.4 Blanking time
      6. 7.3.6 Linear Voltage Regulators
      7. 7.3.7 Logic Level, tri-level, quad-level and seven-level Pin Diagrams
        1. 7.3.7.1 EN/nFAULT Pin
      8. 7.3.8 Protection Circuits
        1. 7.3.8.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.8.2 Overcurrent Protection (OCP)
        3. 7.3.8.3 Thermal Shutdown (OTSD)
        4. 7.3.8.4 Fault Condition Summary
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Disable Mode (nSLEEP = 1, EN/nFAULT = 0/Hi-Z)
      3. 7.4.3 Operating Mode (nSLEEP = 1, EN/nFAULT = 1)
      4. 7.4.4 Functional Modes Summary
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
        4. 8.2.2.4 Application Curves
      3. 8.2.3 Thermal Application
        1. 8.2.3.1 Power Dissipation
          1. 8.2.3.1.1 Conduction Loss
          2. 8.2.3.1.2 Switching Loss
          3. 8.2.3.1.3 Power Dissipation Due to Quiescent Current
          4. 8.2.3.1.4 Total Power Dissipation
        2. 8.2.3.2 Device Junction Temperature Estimation
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (May 2021) to Revision C (July 2022)

  • Updated WQFN layout example.Go
  • Added links to Related Documentation section.Go

Changes from Revision A (November 2020) to Revision B (May 2021)

  • Corrected typo in Table 7-4 Go
  • Removed duplicate package drawingsGo

Changes from Revision * (June 2020) to Revision A (November 2020)

  • Changed device status to production dataGo