SLOSE70 December   2020 DRV8434S

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Indexer Timing Requirements
      1. 6.7.1 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 RMS Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Controlling VREF with an MCU DAC
      5. 7.3.5  Current Regulation
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Slow Decay for Increasing and Decreasing Current
        2. 7.3.6.2 Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 7.3.6.3 Slow Decay for Increasing Current, Fast Decay for Decreasing current
        4. 7.3.6.4 Mixed Decay for Increasing and Decreasing Current
        5. 7.3.6.5 Smart tune Dynamic Decay
        6. 7.3.6.6 Smart tune Ripple Control
      7. 7.3.7  PWM OFF Time
      8. 7.3.8  Blanking time
      9. 7.3.9  Charge Pump
      10. 7.3.10 Linear Voltage Regulators
      11. 7.3.11 Logic Level, tri-level and quad-level Pin Diagrams
        1. 7.3.11.1 nFAULT Pin
      12. 7.3.12 Protection Circuits
        1. 7.3.12.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.12.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.12.3 Overcurrent Protection (OCP)
          1. 7.3.12.3.1 Latched Shutdown (OCP_MODE = 0b)
          2. 7.3.12.3.2 Automatic Retry (OCP_MODE = 1b)
        4. 7.3.12.4 Stall Detection
        5. 7.3.12.5 Open-Load Detection (OL)
        6. 7.3.12.6 Overtemperature Warning (OTW)
        7. 7.3.12.7 Thermal Shutdown (OTSD)
          1. 7.3.12.7.1 Latched Shutdown (OTSD_MODE = 0b)
          2. 7.3.12.7.2 Automatic Recovery (OTSD_MODE = 1b)
        8.       Fault Condition Summary
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2.      56
      3. 7.4.2 Disable Mode (nSLEEP = 1, ENABLE = 0)
      4. 7.4.3 Operating Mode (nSLEEP = 1, ENABLE = 1)
      5. 7.4.4 nSLEEP Reset Pulse
      6.      Functional Modes Summary
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI) Communication
        1. 7.5.1.1 SPI Format
        2. 7.5.1.2 SPI for a Single Target Device
        3. 7.5.1.3 SPI for Multiple Target Devices in Daisy Chain Configuration
        4. 7.5.1.4 SPI for Multiple Target Devices in Parallel Configuration
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Mode
        4. 8.2.2.4 Application Curves
        5. 8.2.2.5 Thermal Application
          1. 8.2.2.5.1 Power Dissipation
          2. 8.2.2.5.2 Conduction Loss
          3. 8.2.2.5.3 Switching Loss
          4. 8.2.2.5.4 Power Dissipation Due to Quiescent Current
          5. 8.2.2.5.5 Total Power Dissipation
          6. 8.2.2.5.6 Device Junction Temperature Estimation
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Typical values are at TA = 25°C and VVM = 24 V. All limits are over recommended operating conditions, unless otherwise noted.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
POWER SUPPLIES (VM, DVDD)
IVMVM operating supply currentENABLE = 1, nSLEEP = 1, No motor load56.5mA
IVMQVM sleep mode supply currentnSLEEP = 024μA
tSLEEPSleep timenSLEEP = 0 to sleep-mode

120

μs
tRESETnSLEEP reset pulsenSLEEP low to clear fault

20

40

μs
tWAKEWake-up timenSLEEP = 1 to output transition0.81.2ms
tONTurn-on timeVM > UVLO to output transition0.81.2ms

tEN

Enable time

ENABLE = 0/1 to output transition

5

μs
VDVDDInternal regulator voltageNo external load,

6V < VVM < 48V

4.7555.25V
No external load,

VVM = 4.5V

4.2

4.35

V

CHARGE PUMP (VCP, CPH, CPL)
VVCPVCP operating voltage6V < VVM < 48VVVM + 5V
f(VCP)Charge pump switching frequencyVVM > UVLO; nSLEEP = 1360kHz
LOGIC-LEVEL INPUTS (STEP, DIR, nSLEEP, nSCS, SCLK, SDI, ENABLE)
VILInput logic-low voltage00.6V
VIHInput logic-high voltage1.55.5V
VHYSInput logic hysteresis150mV
IIL1Input logic-low current (nSCS)VIN = 0 V812μA
IILInput logic-low current (other pins)VIN = 0 V–11μA
IIH1Input logic-high current (nSCS)VIN = DVDD500nA
IIHInput logic-high current (other pins)VIN = 5 V100μA
PUSH-PULL OUTPUT (SDO)
RPD,SDOInternal pull-down resistance5mA load, with respect to GND30

60

Ω
RPU,SDOInternal pull-up resistance5mA load, with respect to VSDO3060Ω
ISDOSDO Leakage CurrentSDO = VSDO and 0V-11μA
CONTROL OUTPUTS (nFAULT)
VOLOutput logic-low voltageIO = 5 mA0.5V
IOHOutput logic-high leakage–11μA
MOTOR DRIVER OUTPUTS (AOUT1, AOUT2, BOUT1, BOUT2)
RDS(ON)High-side FET on resistanceTJ = 25 °C, IO = -1 A165200mΩ
TJ = 125 °C, IO = -1 A250300mΩ
TJ = 150 °C, IO = -1 A280350mΩ
RDS(ON)Low-side FET on resistanceTJ = 25 °C, IO = 1 A165200mΩ
TJ = 125 °C, IO = 1 A250300mΩ
TJ = 150 °C, IO = 1 A280350mΩ
tSROutput slew rateVVM = 24 V, IO = 1 A, Between 10% and 90%240V/µs
PWM CURRENT CONTROL (VREF)
KVTransimpedance gainVREF = 3.3 V1.2541.321.386V/A

IVREF

VREF leakage current

VREF = 3.3 V

8.25

µA
tOFFPWM off-timeTOFF = 00b7μs
TOFF = 01b16
TOFF = 10b24
TOFF = 11b32
ΔITRIPCurrent trip accuracy0.25 A < IO < 0.5 A–1212%
0.5 A < IO < 1 A–6

6

1 A < IO < 2.5 A–4

4

IO,CHAOUT and BOUT current matchingIO = 2.5 A–2.52.5%
PROTECTION CIRCUITS
VUVLOVM UVLO lockoutVM falling, UVLO falling4.14.254.35V
VM rising, UVLO rising4.24.354.45
VUVLO,HYSUndervoltage hysteresisRising to falling threshold100mV
VRSTVM UVLO resetVM falling, device reset, no SPI communications3.9V
VCPUVCharge pump undervoltageVCP falling; CPUV reportVVM + 2V
IOCPOvercurrent protectionCurrent through any FET4A
tOCPOvercurrent deglitch time2μs
tRETRYOvercurrent retry timeOCP_MODE = 1b4ms
tOLOpen load detection timeEN_OL = 1b50ms
IOLOpen load current thresholdEN_OL = 1b75mA
TOTWOvertemperature warningDie temperature TJ135150165°C
TOTSDThermal shutdownDie temperature TJ150165180°C
THYS_OTSDThermal shutdown hysteresisDie temperature TJ20°C
THYS_OTWOvertemperature warning hysteresisDie temperature TJ20°C