SLOSE37B
June 2020 – May 2022
DRV8436
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
5.1
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Indexer Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Stepper Motor Driver Current Ratings
7.3.1.1
Peak Current Rating
7.3.1.2
rms Current Rating
7.3.1.3
Full-Scale Current Rating
7.3.2
PWM Motor Drivers
7.3.3
Microstepping Indexer
7.3.4
Controlling VREF with an MCU DAC
7.3.5
Current Regulation
7.3.6
Decay Modes
7.3.6.1
Slow Decay for Increasing and Decreasing Current
7.3.6.2
Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
7.3.6.3
Mixed Decay for Increasing and Decreasing Current
7.3.6.4
Smart tune Dynamic Decay
7.3.6.5
Smart tune Ripple Control
7.3.6.6
PWM OFF Time
7.3.6.7
Blanking time
7.3.7
Charge Pump
7.3.8
Linear Voltage Regulators
7.3.9
Logic Level, tri-level and quad-level Pin Diagrams
7.3.9.1
nFAULT Pin
7.3.10
Protection Circuits
7.3.10.1
VM Undervoltage Lockout (UVLO)
7.3.10.2
VCP Undervoltage Lockout (CPUV)
7.3.10.3
Overcurrent Protection (OCP)
7.3.10.3.1
Latched Shutdown
7.3.10.3.2
Automatic Retry
7.3.10.4
Thermal Shutdown (OTSD)
7.3.10.5
Fault Condition Summary
7.4
Device Functional Modes
7.4.1
Sleep Mode (nSLEEP = 0)
7.4.2
Disable Mode (nSLEEP = 1, ENABLE = 0)
7.4.3
Operating Mode (nSLEEP = 1, ENABLE = Hi-Z/1)
7.4.4
nSLEEP Reset Pulse
7.4.5
Functional Modes Summary
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Stepper Motor Speed
8.2.2.2
Current Regulation
8.2.2.3
Decay Modes
8.2.3
Application Curves
9
Thermal Application
9.1
Power Dissipation
9.1.1
Conduction Loss
9.1.2
Switching Loss
9.1.3
Power Dissipation Due to Quiescent Current
9.1.4
Total Power Dissipation
9.2
Device Junction Temperature Estimation
10
Layout
10.1
Layout Guidelines
10.2
Layout Examples
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Community Resources
11.4
Trademarks
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGE|24
MPQF124G
PWP|28
MPDS373B
Thermal pad, mechanical data (Package|Pins)
RGE|24
QFND008AA
Orderable Information
slose37b_oa
11.3
Community Resources