SLVSFF0B June   2020  – July 2022 DRV8436E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
    1.     Device Options
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 PWM Motor Drivers
      2. 7.3.2 Bridge Control
      3. 7.3.3 Current Regulation
      4. 7.3.4 Decay Modes
        1. 7.3.4.1 Slow Decay
        2. 7.3.4.2 Mixed Decay
        3. 7.3.4.3 Fast Decay
        4. 7.3.4.4 Smart tune Dynamic Decay
        5. 7.3.4.5 Blanking time
      5. 7.3.5 Charge Pump
      6. 7.3.6 Linear Voltage Regulators
      7. 7.3.7 Logic and Quad-Level Pin Diagrams
        1. 7.3.7.1 nFAULT Pin
      8. 7.3.8 Protection Circuits
        1. 7.3.8.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.8.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.8.3 Overcurrent Protection (OCP)
        4. 7.3.8.4 Thermal Shutdown (OTSD)
        5. 7.3.8.5 36
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Operating Mode (nSLEEP = 1)
      3. 7.4.3 Functional Modes Summary
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Primary Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Current Regulation
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Current Regulation
        2. 8.3.2.2 Stepper Motor Speed
        3. 8.3.2.3 Decay Modes
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision A (August 2020) to Revision B (July 2022)

  • Added Typical Characteristics curves.Go
  • Updated HTSSOP and QFN layout examples.Go

Changes from Revision * (June 2020) to Revision A (August 2020)

  • Changed device status to "Production Data"Go