SLOS709C June   2011  – December 2022 DRV8662

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fast Start-up (Enable Pin)
      2. 7.3.2 Gain Control
      3. 7.3.3 Adjustable Boost Voltage
      4. 7.3.4 Adjustable Boost Current Limit
      5. 7.3.5 Internal Charge Pump
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Startup/shutdown Sequencing
        1. 7.4.1.1 PWM Source
        2. 7.4.1.2 DAC Source
      2. 7.4.2 Low-voltage Operation
    5. 7.5 Programming
      1. 7.5.1 Programming the Boost Voltage
      2. 7.5.2 Programing the Boost Current Limit
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DRV8662 System Diagram with DAC Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Piezo Actuator Selection
          3. 8.2.1.2.3 Boost Capacitor Selection
          4. 8.2.1.2.4 Current Consumption Calculation
          5. 8.2.1.2.5 Input Filter Considerations
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DRV8662 System Diagram with Filtered Single-Ended PWM Input
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Input Filter Design
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)DRV8662UNIT
RGP (20 Pins)
RθJAJunction-to-ambient thermal resistance33.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance30.9
RθJBJunction-to-board thermal resistance8.7
ψJTJunction-to-top characterization parameter0.4
ψJBJunction-to-board characterization parameter8.7
RθJC(bot)Junction-to-case (bottom) thermal resistance2.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.