SLVSCX5B March   2015  – July 2015 DRV8701

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Bridge Control
      2. 7.3.2  Half-Bridge Operation
      3. 7.3.3  Current Regulation
      4. 7.3.4  Amplifier Output SO
        1. 7.3.4.1 SNSOUT
      5. 7.3.5  PWM Motor Gate Drivers
      6. 7.3.6  IDRIVE Pin
      7. 7.3.7  Dead Time
      8. 7.3.8  Propagation Delay
      9. 7.3.9  Overcurrent VDS Monitor
      10. 7.3.10 Charge Pump
      11. 7.3.11 LDO Voltage Regulators
      12. 7.3.12 Gate Drive Clamp
      13. 7.3.13 Protection Circuits
        1. 7.3.13.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.13.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.13.3 Overcurrent Protection (OCP)
        4. 7.3.13.4 Pre-Driver Fault (PDF)
        5. 7.3.13.5 Thermal Shutdown (TSD)
      14. 7.3.14 Reverse Supply Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating DRV8701 and H-Bridge on Separate Supplies
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Brushed-DC Motor Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 External FET Selection
          2. 8.2.1.2.2 IDRIVE Configuration
          3. 8.2.1.2.3 Current Chopping Configuration
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternate Application
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 IDRIVE Configuration
        2. 8.2.3.2 VM Boost Voltage
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.