SLVSCX5B March   2015  – July 2015 DRV8701

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Bridge Control
      2. 7.3.2  Half-Bridge Operation
      3. 7.3.3  Current Regulation
      4. 7.3.4  Amplifier Output SO
        1. 7.3.4.1 SNSOUT
      5. 7.3.5  PWM Motor Gate Drivers
      6. 7.3.6  IDRIVE Pin
      7. 7.3.7  Dead Time
      8. 7.3.8  Propagation Delay
      9. 7.3.9  Overcurrent VDS Monitor
      10. 7.3.10 Charge Pump
      11. 7.3.11 LDO Voltage Regulators
      12. 7.3.12 Gate Drive Clamp
      13. 7.3.13 Protection Circuits
        1. 7.3.13.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.13.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.13.3 Overcurrent Protection (OCP)
        4. 7.3.13.4 Pre-Driver Fault (PDF)
        5. 7.3.13.5 Thermal Shutdown (TSD)
      14. 7.3.14 Reverse Supply Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating DRV8701 and H-Bridge on Separate Supplies
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Brushed-DC Motor Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 External FET Selection
          2. 8.2.1.2.2 IDRIVE Configuration
          3. 8.2.1.2.3 Current Chopping Configuration
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternate Application
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 IDRIVE Configuration
        2. 8.2.3.2 VM Boost Voltage
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (May 2015) to B Revision

  • Updated test conditions for IDRIVE,SNK and corrected TYP valuesGo

Changes from * Revision (March 2015) to A Revision

  • Updated device status to production data Go