SLVSAW4G July   2011  – December 2024 DRV8804

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 Thermal Information
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Drivers
      2. 7.3.2 Serial Interface Operation
        1.       Daisy Chain Operation
      3. 7.3.3 nENBL and RESET Operation
      4. 7.3.4 Protection Circuits
        1. 7.3.4.1 Overcurrent Protection (OCP)
        2. 7.3.4.2 Thermal Shutdown (TSD)
        3. 7.3.4.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Motor Voltage
        2. 8.2.2.2 Drive Current
      3. 8.2.3 Application Curves
    3.     Power Supply Recommendations
      1. 8.3.1 Bulk Capacitance
    4. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
      3. 8.3.3 Thermal Considerations
        1. 8.3.3.1 Power Dissipation
        2. 8.3.3.2 Heatsinking
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Community Resources
    3. 9.3 Trademarks
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information

THERMAL METRIC(1)DRV8804UNIT
DW (SOIC)PWP (HTSSOP)

DYZ (SOT -23 THN)

20 PINS16 PINS

16 PINS

RθJAJunction-to-ambient thermal resistance67.739.6

53.2

°C/W
RθJC(top)Junction-to-case (top) thermal resistance32.924.6

76.8

°C/W
RθJBJunction-to-board thermal resistance35.420.3

22.2

°C/W
ψJTJunction-to-top characterization parameter8.20.7

8.2

°C/W
ψJBJunction-to-board characterization parameter34.920.1

22.2

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A2.3

9.6

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.