SLVSAW3D July   2011  – January 2016 DRV8805

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Drivers
      2. 7.3.2 Indexer Operation
      3. 7.3.3 nENBL and RESET Operation
      4. 7.3.4 Protection Circuits
        1. 7.3.4.1 Overcurrent Protection (OCP)
        2. 7.3.4.2 Thermal Shutdown (TSD)
        3. 7.3.4.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Step Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Motor Voltage
        2. 8.2.2.2 Drive Current
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Power Dissipation
      2. 10.3.2 Heatsinking
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VM Power supply voltage –0.3 65 V
VOUTx Output voltage –0.3 65 V
VCLAMP Clamp voltage –0.3 65 V
Digital input pin voltage –0.5 7 V
nHOME,
nFAULT		 Digital output pin voltage –0.5 –0.5 to 7 V
nHOME,
nFAULT		 Output current 20 mA
Peak clamp diode current 2 A
DC or RMS clamp diode current 1 A
Peak motor drive output current, t < 1 μS Internally limited A
Continuous total power dissipation See Thermal Information
TJ Operating virtual junction temperature –40 150 °C
Tstg Storage temperature –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±3000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VM Power supply voltage 8.2 60 V
VCLAMP Output clamp voltage (2) 0 60 V
IOUT Continuous output current, single channel on, TA = 25°C, SOIC package(1) 1.5 A
Continuous output current, four channels on, TA = 25°C, SOIC package(1) 0.8
Continuous output current, single channel on, TA = 25°C, HTSSOP package(1) 2
Continuous output current, four channels on, TA = 25°C, HTSSOP package(1) 1
(1) Power dissipation and thermal limits must be observed.
(2) VCLAMP is used only to supply the clamp diodes. It is not a power supply input.

6.4 Thermal Information

THERMAL METRIC(1) DRV8805 UNIT
DW (SOIC) PWP (HTSSOP)
20 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 67.7 39.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.9 24.6 °C/W
RθJB Junction-to-board thermal resistance 35.4 20.3 °C/W
ψJT Junction-to-top characterization parameter 8.2 0.7 °C/W
ψJB Junction-to-board characterization parameter 34.9 20.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 2.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TA = 25°C, over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLIES
IVM VM operating supply current VM = 24 V 1.6 2.1 mA
VUVLO VM undervoltage lockout voltage VM rising 8.2 V
LOGIC-LEVEL INPUTS(SCHMITT TRIGGER INPUTS WITH HYSTERESIS)
VIL Input low voltage 0.6 0.7 V
VIH Input high voltage 2 V
VHYS Input hysteresis 0.45 V
IIL Input low current VIN = 0 –20 20 μA
IIH Input high current VIN = 3.3 V 100 μA
RPD Pulldown resistance 100 kΩ
nFAULT OUTPUT (OPEN-DRAIN OUTPUT)
VOL Output low voltage IO = 5 mA 0.5 V
IOH Output high leakage current VO = 3.3 V 1 μA
nHOME OUTPUT (OPEN-DRAIN OUTPUT WITH WEAK INTERNAL PULLUP)
VOL Output low voltage IO = 5 mA 0.5 V
VOH Output high voltage IO = 100 µA, VM = 11 V – 60 V, peak 6.5 V
IO = 100 μA, VM = 11 V – 60 V, steady state 3.3 4.5 5.6
IO = 100 μA, VM = 8.2 V – 11 V, steady state 2.5
ISRC Output source current VM = 24 V 1 mA
ISNK Output sink current VM = 24 V 5 mA
LOW-SIDE FETS
RDS(ON) FET on resistance VM = 24 V, IO = 700 mA, TJ = 25°C 0.5 Ω
VM = 24 V, IO = 700 mA, TJ = 85°C 0.75 0.8
IOFF Off-state leakage current –50 50 μA
HIGH-SIDE DIODES
VF Diode forward voltage VM = 24 V, IO = 700 mA, TJ = 25°C 1.2 V
IOFF Off-state leakage current VM = 24 V, TJ = 25°C –50 50 μA
OUTPUTS
tR Rise time VM = 24 V, IO = 700 mA, Resistive load 50 300 ns
tF Fall time VM = 24 V, IO = 700 mA, Resistive load 50 300 ns
PROTECTION CIRCUITS
IOCP Overcurrent protection trip level 2.3 3.8 A
tOCP Overcurrent protection deglitch time 3.5 µs
tRETRY Overcurrent protection retry time 1.2 ms
tTSD Thermal shutdown temperature Die temperature(1) 150 160 180 °C
(1) Not production tested.

6.6 Timing Requirements

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
1 fSTEP Step frequency 250 kHz
2 tWH(STEP) Pulse duration, STEP high 1.9 µs
3 tWL(STEP) Pulse duration, STEP low 1.9 µs
4 tSU(STEP) Setup time, DIR, SMx to STEP rising 1 µs
5 tH(STEP) Hold time, DIR, SMx to STEP rising 1 µs
6 tOE(ENABLE) Enable time, nENBL to output low 50 ns
7 tPD(L-H) Propagation delay time, STEP to OUTx, low to high 500 ns
8 tPD(H-L) Propagation delay time, STEP to OUTx, high to low 500 ns
— tRESET RESET pulse width 20 µs
(1) Not production tested.
DRV8805 timing_req_lvsaw3.gif Figure 1. DRV8805 Timing Requirements

6.7 Typical Characteristics

DRV8805 C002_SLVSAW5.png
Figure 2. Supply Current Over VM
DRV8805 C006_SLVSAW5.png
Figure 4. RDS(ON) Over VM
DRV8805 C001_SLVSAW5.png
Figure 3. Supply Current Over Temperature
DRV8805 C005_SLVSAW5.png
Figure 5. RDS(ON) Over Temperature