SLVS865J September   2008  – April 2017 DRV8811

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM H-Bridge Drivers
      2. 7.3.2 Current Regulation
      3. 7.3.3 Decay Mode
      4. 7.3.4 Microstepping Indexer
      5. 7.3.5 Protection Circuits
        1. 7.3.5.1 Overcurrent Protection (OCP)
        2. 7.3.5.2 Thermal Shutdown (TSD)
        3. 7.3.5.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 RESETn, ENABLEn and SLEEPn Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Information
      1. 10.3.1 Heatsinking
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1) (2) (3)
MIN MAX UNIT
Power supply voltage range VMA, VMB –0.3 40 V
Power supply voltage range VCC –0.3 7 V
Digital pin voltage range VI: DIR, DECAY, ENABLEn, HOME, RCA, RCB, RESETn, SLEEPn, SRn, STEP, USM0, USM1 –0.5 7 V
Reference pin voltage range VREF –0.3 7 V
Sense pin voltage range ISENA, ISENB(4) –0.875 0.875 V
Output pin voltage range AOUT1, AOUT2, BOUT1, BOUT2 –0.7 VVM + 0.7 V
Gate-drive pin-voltage range VGD –0.3 8 V
Charge pump pin voltage range VCP, CP2 –0.3 VVM + 12 V
CP1 –0.3 VVM
Peak motor drive output current, IO(peak) Internally limited
Operating virtual junction temperature range, TJ –40 150 °C
Operating ambient temperature range, TA –40 85 °C
Storage temperature range, Tstg –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed.
(4) Transients of ±1 V for less than 25 ns are acceptable.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VVMx Motor power supply voltage range(1) 8 38 V
VCC Logic power supply voltage range 3 5.5 V
VVREF VREF input voltage 0 VCC V
RX RX resistance value 12 56 100 kΩ
CX CX capacitance value 470 680 1500 pF
(1) Both VMx pins must be connected to the same supply voltage.

6.4 Thermal Information

THERMAL METRIC(1) DRV8811 UNIT
PWP (HTSSOP)
28 PINS
RθJA Junction-to-ambient thermal resistance 31.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 19.3 °C/W
RθJB Junction-to-board thermal resistance 11.5 °C/W
ψJT Junction-to-top characterization parameter 0.4 °C/W
ψJB Junction-to-board characterization parameter 11.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.8 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

6.5 Electrical Characteristics

over operating ambient temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLIES
IVM VM operating supply current VM = 35 V, fPWM < 50 KHz 4.5 8 mA
IVCC VCC operating supply current fPWM < 50 KHz 0.4 4 mA
IVMQ VM sleep mode supply current VM = 35 V 12 20 μA
IVCCQ VCC sleep mode supply current 5 20 μA
VUVLO VM undervoltage lockout voltage VM rising 6.7 8 V
VCC undervoltage lockout voltage VCC rising 2.71 2.95
VREF INPUT, CURRENT CONTROL ACCURACY
IVREF VREF input current VVREF = 3.3 V –3 3 μA
ΔICHOP Chopping current accuracy VVREF = 2 V, 70% to 100% current –5% 5%
VVREF = 2 V, 20% to 56% current –10% 10%
LOGIC-LEVEL INPUTS
VIL Input low voltage 0.3 × VCC V
VIH Input high voltage 0.7 × VCC V
IIL Input low current VI = 0.3 × VCC –20 20 μA
IIH Input high current VIN = 0.3 × VCC –20 20 μA
RPU Pullup resistance ENABLEn, RESETn 1 MΩ
RPD Pulldown resistance DIR, STEP, SLEEPn, USM1, USM0, SRn 1 MΩ
HOMEn OUTPUT
VOL Output low voltage IO = 200 μA 0.3 × VCC V
VOH Output high voltage IO = –200 μA 0.7 × VCC V
DECAY INPUT
VIL Input low threshold voltage For fast decay mode 0.21 × VCC V
VIH Input high threshold voltage For slow decay mode 0.6 × VCC V
H-BRIDGE FETS
rDS(on) HS FET on resistance VM = 24 V, IO = 2.5 A, TJ = 25°C 0.50 Ω
VM = 24 V, IO = 2.5 A, TJ = 85°C 0.60 0.75
rDS(on) LS FET on resistance VM = 24 V, IO = 2.5 A, TJ = 25°C 0.50 Ω
VM = 24 V, IO = 2.5 A, TJ = 85°C 0.60 0.75
IOFF –20 20 μA
MOTOR DRIVER
tOFF Off-time Rx = 56 kΩ, Cx = 680 pF 30 38 46 μs
tBLANK Current-sense blanking time Rx = 56 kΩ, Cx = 680 pF 700 950 1200 ns
tDT Dead time(1) SRn = 0 100 475 800 ns
PROTECTION CIRCUITS
IOCP Overcurrent protection trip level 2.5 4.5 6.5 A
tTSD Thermal shutdown temperature(1) Die temperature 150 160 180 °C
(1) Not tested in production - guaranteed by design.

6.6 Timing Requirements

over operating ambient temperature range (unless otherwise noted) (see Figure 1)
MIN TYP MAX UNIT
1 fSTEP Step frequency 500 kHz
2 tWH(STEP) Pulse duration, STEP high 1 μs
3 tWL(STEP) Pulse duration, STEP low 1 μs
4 tSU(STEP) Setup time, command before STEP rising 200 ns
5 tH(STEP) Hold time, command after STEP rising 200 ns
6 tWAKE Wakeup time, SLEEPn high to STEP input accepted 1 ms
7 tSLEEP Sleep time, SLEEPn low to outputs disabled 5 μs
8 tENABLE Enable time, ENABLEn high to outputs enabled 20 μs
9 tDISABLE Disable time, ENABLEn low to outputs disabled 20 μs
10 tRESETR Reset release time, RESETn high to outputs enabled 5 μs
11 tRESET Reset time, RESETn low to outputs disabled 5 μs

6.7 Switching Characteristics

over operating ambient temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MOTOR DRIVER
tOFF Off-time Rx = 56 kΩ, Cx = 680 pF 30 38 46 μs
tBLANK Current-sense blanking time Rx = 56 kΩ, Cx = 680 pF 700 950 1200 ns
tDT Dead time(1) SRn = 0 100 475 800 ns
DRV8811 td2_slvs865.gif Figure 1. Timing Diagram

6.8 Typical Characteristics

DRV8811 D001_slvs865.gif
Figure 2. IVM vs VM
DRV8811 D003_slvs865.gif
Figure 4. rDS(on) HS and LS vs VM
DRV8811 D002_slvs865.gif
Figure 3. IVMQ vs VM
DRV8811 D004_slvs865.gif
Figure 5. rDS(on) HS and LS vs Temperature