SLVSCH0 April   2014 DRV8824-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Terminal Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 PWM Motor Drivers
      2. 8.3.2 Current Regulation
      3. 8.3.3 Blanking Time
      4. 8.3.4 Microstepping Indexer
      5. 8.3.5 nRESET, nENBLE and nSLEEP Operation
      6. 8.3.6 Protection Circuits
        1. 8.3.6.1 Overcurrent Protection (OCP)
        2. 8.3.6.2 Thermal Shutdown (TSD)
        3. 8.3.6.3 Undervoltage Lockout (UVLO)
      7. 8.3.7 Thermal Information
        1. 8.3.7.1 Thermal Protection
        2. 8.3.7.2 Power Dissipation
        3. 8.3.7.3 Heatsinking
    4. 8.4 Device Functional Modes
      1. 8.4.1 Decay Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Stepper Motor Speed
        2. 9.2.2.2 Current Regulation
        3. 9.2.2.3 Decay Modes
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

The VMA and VMB terminals should be bypassed to GND using low-ESR ceramic bypass capacitors with a recommended value of 0.01 µF rated for VM. This capacitor should be placed as close to the VMA and VMB pins as possible with a thick trace or ground plane connection to the device GND pin.

The VMA and VMB pins must be bypassed to ground using a bulk capacitor. This component may be an electrolytic. If VMA and VMB are connected to the same board net, a single bulk capacitor is sufficient.

A low-ESR ceramic capacitor must be placed in between the CPL and CPH pins. A value of 0.01 µF rated for VMA and VMB is recommended. Place this component as close to the pins as possible.

A low-ESR ceramic capacitor must be placed in between the VMA and VCP pins. A value of 0.1 µF rated for 16 V is recommended. Place this component as close to the pins as possible. In addition place a 1-MΩ resistor between VCP and VMA.

Bypass V3P3 to ground with a ceramic capacitor rated 6.3 V. Place this bypassing capacitor as close to the pin as possible.

11.2 Layout Example

layout_slvsch0.gifFigure 12. DRV8824-Q1 Board Layout