SLVSB19D February   2012  – March 2015 DRV8834

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Control
      2. 8.3.2 Current Recirculation and Decay Modes
      3. 8.3.3 Protection Circuits
        1. 8.3.3.1 Overcurrent Protection (OCP)
        2. 8.3.3.2 Thermal Shutdown (TSD)
        3. 8.3.3.3 Undervoltage Lockout (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Phase/Enable Mode
      2. 8.4.2 Indexer Mode
      3. 8.4.3 nSLEEP Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Sense Resistor
    2. 9.2 Typical Application
      1. 9.2.1 Phase/Enable Mode Driving Two DC Motors
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Motor Voltage
          2. 9.2.1.2.2 Power Dissipation
          3. 9.2.1.2.3 Motor Current Trip Point
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Phase/Enable Mode Driving a Stepper Motor
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Stepper Motor Speed
          2. 9.2.2.2.2 Current Regulation
          3. 9.2.2.2.3 Decay Modes
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Indexer Mode Driving a Stepper Motor
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedures
          1. 9.2.3.2.1 Stepper Motor Speed
          2. 9.2.3.2.2 Current Regulation
          3. 9.2.3.2.3 Decay Modes
        3. 9.2.3.3 Application Curves
      4. 9.2.4 High-Resolution Microstepping Using a Microcontroller to Modulate VREF Signals
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Maximum Output Current
      2. 11.3.2 Thermal Protection
      3. 11.3.3 Power Dissipation
      4. 11.3.4 Heatsinking
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

  • High Resolution Microstepping Driver With the DRV88xx Series, SLVA416
  • PowerPAD™ Thermally Enhanced Package, SLMA002
  • PowerPAD™ Made Easy, SLMA004

12.2 Trademarks

PowerPAD is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.