SLVSBA4F June   2012  – April 2021 DRV8837 , DRV8838

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2. 5.1 Dapper Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bridge Control
      2. 7.3.2 Independent Half-Bridge Control
      3. 7.3.3 Sleep Mode
      4. 7.3.4 Power Supplies and Input Pins
      5. 7.3.5 Protection Circuits
        1. 7.3.5.1 VCC Undervoltage Lockout
        2. 7.3.5.2 Overcurrent Protection (OCP)
        3. 7.3.5.3 Thermal Shutdown (TSD)
        4. 7.3.5.4 28
    4. 7.4 Device Functional Modes
  8. 8 Power Supply Recommendations
    1. 8.1 Bulk Capacitance
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Power Dissipation
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC(1)DRV883xUNIT
DSG (WSON)
8 PINS
RθJAJunction-to-ambient thermal resistance60.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance71.4°C/W
RθJBJunction-to-board thermal resistance32.2°C/W
ψJTJunction-to-top characterization parameter1.6°C/W
ψJBJunction-to-board characterization parameter32.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance9.8°C/W
(1) For more information about traditional and new thermal limits, see the Semiconductor and IC Package Thermal Metrics application report.