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  • DRV8837C 1-A Low-Voltage H-Bridge Driver

    • SLVSD61A July   2016  – July 2016 DRV8837C

      PRODUCTION DATA.  

  • CONTENTS
  • SEARCH
  • DRV8837C 1-A Low-Voltage H-Bridge Driver
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bridge Control
      2. 7.3.2 Sleep Mode
      3. 7.3.3 Power Supplies and Input Pins
      4. 7.3.4 Protection Circuits
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Motor Voltage
        2. 8.2.2.2 Low-Power Operation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • DSG|8
    • MPDS308C
Thermal pad, mechanical data (Package|Pins)
  • DSG|8
    • QFND141I
Orderable Information
  • slvsd61a_oa
  • slvsd61a_pm
search No matches found.
  • Full reading width
    • Full reading width
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    • Expanded reading width
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DATA SHEET

DRV8837C 1-A Low-Voltage H-Bridge Driver

1 Features

  • H-Bridge Motor Driver
    • Drives a DC Motor or Other Loads
    • Low MOSFET On-Resistance: HS + LS 1 Ω
  • 1-A Maximum Drive Current
  • 0- to 11-V Operating Supply-Voltage Range
  • Standard PWM Interface (IN1/IN2)
  • Low-Power Sleep Mode With 120-nA Maximum Sleep Current
    • nSLEEP pin
  • Small Package and Footprint
    • 8 WSON (With Thermal Pad)
    • 2.0 × 2.0 mm
  • Protection Features
    • VCC Undervoltage Lockout (UVLO)
    • Overcurrent Protection (OCP)
    • Thermal Shutdown (TSD)

2 Applications

  • Cameras
  • DSLR Lenses
  • Consumer Products
  • Toys
  • Robotics
  • Medical Devices

3 Description

The DRV8837C device provides an integrated motor driver solution for cameras, consumer products, toys, and other low-voltage or battery-powered motion control applications. The device can drive one DC motor or other devices like solenoids. The output driver block consists of N-channel power MOSFETs configured as an H-bridge to drive the motor winding. An internal charge pump generates needed gate drive voltages.

The DRV8837C device can supply up to 1 A of output current. The device operates on a motor power supply voltage from 0 to 11 V, and control logic can operate on 1.8-V to 5-V rails.

The DRV8837C device has a PWM (IN/IN) input interface.

Internal shutdown functions are provided for overcurrent protection, short circuit protection, undervoltage lockout, and overtemperature.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
DRV8837C WSON (8) 2.00 mm × 2.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

DRV8837C Simplified Diagram

DRV8837C fad_DSG_slvsd61.gif

4 Revision History

Changes from * Revision (July 2016) to A Revision

  • Changed the device status from Product Preview to Production DataGo

5 Pin Configuration and Functions

DSG Package
8-Pin WSON With Exposed Thermal Pad
Top View

Pin Functions

PIN TYPE DESCRIPTION
NAME NO.
POWER AND GROUND
GND 4 PWR Device ground
This pin must be connected to the PCB ground.
VCC 8 PWR Logic power supply
Bypass this pin to the GND pin with a 0.1-µF ceramic capacitor rated for VCC.
VM 1 PWR Motor power supply
Bypass this pin to the GND pin with a 0.1-µF ceramic capacitor rated for VM.
CONTROL
IN1 6 I IN1 input
IN2 5 I IN2 input
nSLEEP 7 I Sleep mode input
When this pin is in logic low, the device enters low-power sleep mode. The device operates normally when this pin is logic high. The pin has an internal pulldown resistor to GND.
OUTPUT
OUT1 2 O Motor output
Connect this pin to the motor winding.
OUT2 3 O

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Motor power-supply voltage VM –0.3 12 V
Logic power-supply voltage VCC –0.3 7 V
Control pin voltage IN1, IN2, nSLEEP –0.5 7 V
Peak drive current OUT1, OUT2 Internally limited A
Operating virtual junction temperature, TJ –40 150 ºC
Storage temperature, Tstg –60 150 ºC
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground pin.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VVM Motor power-supply voltage 0 11 V
VCC Logic power-supply voltage 1.8 7 V
IOUT Motor peak current 0 1 A
fPWM Externally applied PWM frequency 0 250 kHz
VLOGIC Logic level input voltage 0 5.5 V
TA Operating ambient temperature –40 85 °C

6.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC (1) DRV8837C UNIT
DSG (WSON)
8 PINS
RθJA Junction-to-ambient thermal resistance 60.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 71.4 °C/W
RθJB Junction-to-board thermal resistance 32.2 °C/W
ψJT Junction-to-top characterization parameter 1.6 °C/W
ψJB Junction-to-board characterization parameter 32.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

TA = 25°C, over recommended operating conditions unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLIES (VM, VCC)
VVM VM operating voltage 0 11 V
IVM VM operating supply current VVM = 5 V; VCC = 3 V;
No PWM		 40 100 μA
VVM = 5 V; VCC = 3 V;
50 kHz PWM		 0.8 1.5 mA
IVMQ VM sleep mode supply current VVM = 5 V; VCC = 3 V;
nSLEEP = 0		 30 95 nA
VCC VCC operating voltage 1.8 7 V
IVCC VCC operating supply current VVM = 5 V; VCC = 3 V;
No PWM		 300 500 μA
VVM = 5 V; VCC = 3 V;
50 kHz PWM		 0.7 1.5 mA
IVCCQ VCC sleep mode supply current VVM = 5 V; VCC = 3 V;
nSLEEP = 0		 5 25 nA
CONTROL INPUTS (IN1/PH, IN2/EN, nSLEEP)
VIL Input logic-low voltage 0.25 × VCC V
VIH Input logic-high voltage 0.5 × VCC V
VHYS Input logic hysteresis 0.08 × VCC V
IIL Input logic-low current VINx = 0 V –5 5 μA
IIH Input logic-high current VINx = 3.3 V 50 μA
RPD Pulldown resistance 100 kΩ
MOTOR DRIVER OUTPUTS (OUT1, OUT2)
RDS(ON) HS + LS FET on-resistance VVM = 5 V; VCC = 3.3 V;
IO = 200 mA; TJ = 25°C		 1000 mΩ
IOFF Off-state leakage current VOUTx = 0 V –200 200 nA
PROTECTION CIRCUITS
VUVLO VCC undervoltage lockout VCC falling 1.7 V
VCC rising 1.8 V
IOCP Overcurrent protection trip level 1.2 A
tDEG Overcurrent deglitch time 1 μs
tRETRY Overcurrent retry time 1 ms
TTSD (1) Thermal shutdown temperature Die temperature TJ 150 160 180 °C
(1) Not tested in production; limits are based on characterization data

6.6 Timing Requirements

TA = 25°C, VVM = 5 V, VCC = 3 V, RL = 20 Ω
NO. MIN MAX UNIT
1 t7 Output enable time See Figure 1. 300 ns
2 t8 Output disable time 300 ns
3 t9 Delay time, INx high to OUTx high 160 ns
4 t10 Delay time, INx low to OUTx low 160 ns
5 t11 Output rise time 20 188 ns
6 t12 Output fall time 20 188 ns
— twake Wake time, nSLEEP rising edge to part active 30 μs
DRV8837C timing_DRV8837C.gif Figure 1. Input and Output Timing for DRV8837C

6.7 Typical Characteristics

Plots generated using characterization data.
DRV8837C D001_SLVSD61.gif
VVM = 5 V VCC = 3 V
Figure 2. VM Sleep Current vs Ambient Temperature
DRV8837C D003_SLVSD61.gif
VVM = 5 V VCC = 3 V
Figure 4. VM Operating Current vs Ambient Temperature
DRV8837C D005_SLVSD61.gif Figure 6. HS + LS RDS(ON) vs Ambient Temperature
DRV8837C D002_SLVSD61.gif
VVM = 5 V VCC = 3 V
Figure 3. VCC Sleep Current vs Ambient Temperature
DRV8837C D004_SLVSD61.gif
VVM = 5 V VCC = 3 V
Figure 5. VCC Operating Current vs Ambient Temperature

 
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