SLVSCH4 July   2014 DRV8842-EP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Motor Driver Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 PWM Motor Drivers
      2. 8.3.2 Bridge Control
      3. 8.3.3 Current Regulation
      4. 8.3.4 Blanking Time
      5. 8.3.5 nRESET and nSLEEP Operation
      6. 8.3.6 Protection Circuits
        1. 8.3.6.1 Overcurrent Protection (OCP)
        2. 8.3.6.2 Thermal Shutdown (TSD)
        3. 8.3.6.3 Undervoltage Lockout (UVLO)
      7. 8.3.7 Thermal Protection
      8. 8.3.8 Heatsinking
    4. 8.4 Device Functional Modes
      1. 8.4.1 Decay Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Dissipation
        2. 9.2.2.2 Current Regulation Considerations
        3. 9.2.2.3 Slow, Fast, and Mixed Decay Modes
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
    2. 10.2 Power Supply and Logic Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Trademarks

PowerPAD is a trademark of Texas Instruments.

12.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.