SLVSE65C July   2018  – December 2023 DRV8847

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Motor Drivers
      2. 7.3.2 Bridge Operation
        1. 7.3.2.1 Forward Operation
        2. 7.3.2.2 Reverse Operation
        3. 7.3.2.3 Coast Operation (Fast Decay)
        4. 7.3.2.4 Brake Operation (Slow Decay)
      3. 7.3.3 Bridge Control
        1. 7.3.3.1 4-Pin Interface
        2. 7.3.3.2 2-Pin Interface
        3. 7.3.3.3 Parallel Bridge Interface
        4. 7.3.3.4 Independent Bridge Interface
      4. 7.3.4 Current Regulation
      5. 7.3.5 Current Recirculation and Decay Modes
      6. 7.3.6 Torque Scalar
      7. 7.3.7 Stepping Modes
        1. 7.3.7.1 Full-Stepping Mode (4-Pin Interface)
        2. 7.3.7.2 Full-Stepping Mode (2-Pin Interface)
        3. 7.3.7.3 Half-Stepping Mode (With Non-Driving Fast Decay)
        4. 7.3.7.4 Half-Stepping Mode (With Non-Driving Slow Decay)
      8. 7.3.8 Motor Driver Protection Circuits
        1. 7.3.8.1 Overcurrent Protection (OCP)
          1. 7.3.8.1.1 OCP Automatic Retry (Hardware Device and Software Device (OCPR = 0b))
          2. 7.3.8.1.2 OCP Latch Mode (Software Device (OCPR = 1b))
          3. 7.3.8.1.3 42
        2. 7.3.8.2 Thermal Shutdown (TSD)
        3. 7.3.8.3 VM Undervoltage Lockout (VM_UVLO)
        4. 7.3.8.4 Open Load Detection (OLD)
          1. 7.3.8.4.1 Full-Bridge Open Load Detection
          2. 7.3.8.4.2 Load Connected to VM
          3. 7.3.8.4.3 Load Connected to GND
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C Communication
        1. 7.5.1.1 I2C Write
        2. 7.5.1.2 I2C Read
      2. 7.5.2 Multi-Slave Operation
    6. 7.6 Register Map
      1. 7.6.1 Slave Address Register (Address = 0x00) [reset = 0x60]
      2. 7.6.2 IC1 Control Register (Address = 0x01) [reset = 0x00]
      3. 7.6.3 IC2 Control Register (Address = 0x02) [reset = 0x00]
      4. 7.6.4 Slew-Rate and Fault Status-1 Register (Address = 0x03) [reset = 0x40]
      5. 7.6.5 Fault Status-2 Register (Address = 0x04) [reset = 0x00]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Stepper Motor Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Stepping Modes
            1. 8.2.1.2.1.1 Full-Stepping Operation
            2. 8.2.1.2.1.2 Half-Stepping Operation with Fast Decay
            3. 8.2.1.2.1.3 Half-Stepping Operation with Slow Decay
          2. 8.2.1.2.2 Current Regulation
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Dual BDC Motor Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Motor Voltage
          2. 8.2.2.2.2 Current Regulation
          3. 8.2.2.2.3 Sense Resistor
      3. 8.2.3 Open Load Implementation
        1. 8.2.3.1 Open Load Detection Circuit
        2. 8.2.3.2 OLD for Ground Connected Load
          1. 8.2.3.2.1 Half Bridge Open
          2. 8.2.3.2.2 Half Bridge Short
          3. 8.2.3.2.3 Load Connected
        3. 8.2.3.3 OLD for Supply (VM) Connected Load
          1. 8.2.3.3.1 Half Bridge Open
          2. 8.2.3.3.2 Half Bridge Short
          3. 8.2.3.3.3 Load Connected
        4. 8.2.3.4 OLD for Full Bridge Connected Load
          1. 8.2.3.4.1 Full Bridge Open
            1. 8.2.3.4.1.1 High side comparator of half-bridge-1 (OL1_HS)
            2. 8.2.3.4.1.2 Low side comparator of half-bridge-2 (OL2_LS)
          2. 8.2.3.4.2 Full Bridge Short
            1. 8.2.3.4.2.1 High side comparator of half-bridge-1 (OL1_HS)
            2. 8.2.3.4.2.2 Low side comparator of half-bridge-2 (OL2_LS)
          3. 8.2.3.4.3 Load Connected in Full Bridge
            1. 8.2.3.4.3.1 High side comparator of half-bridge-1 (OL1_HS)
            2. 8.2.3.4.3.2 Low side comparator of half-bridge-2 (OL2_LS)
  10.   Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  11. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
      1. 9.3.1 Maximum Output Current
      2. 9.3.2 Thermal Protection
    4. 9.4 Power Dissipation
  12. 10Device and Documentation Support
    1. 10.1 Device Support (Optional)
      1. 10.1.1 Development Support (Optional)
      2. 10.1.2 Device Nomenclature (Optional)
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
  13. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • PWP|16
  • RTE|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)
MINMAXUNIT
Power supply pin voltage (VM)-0.320V
Power supply voltage ramp rate (VM)02V/µs
Digital pin voltage (IN1, IN2, IN3, IN4, TRQ, nSLEEP, nFAULT, SCL, SDA)-0.35.75V
Continuous phase node pin voltage (OUT1, OUT2, OUT3, OUT4)-0.7VM + 0.6V
Shunt amplifier input pin voltage (ISEN12, ISEN34)(2)-0.60.6V
Peak drive current (OUT1, OUT2, OUT3, OUT4), VVM <= 16.5 V(3)Internally LimitedA
Peak drive current (OUT1, OUT2, OUT3, OUT4), VVM > 16.5 V(3)04A
Ambient temperature, TA-40125°C
Junction temperature, TJ-40150°C
Storage temperature, Tstg-65150°C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Transients of ±1 V for less than 25 ns are acceptable.
(3) Power dissipation and thermal limits must be observed.