SLLSEL7B October   2014  – April 2024 DRV8848

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2.     External Components
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings Comm
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 PWM Motor Drivers
      2. 6.3.2 Bridge Control
      3. 6.3.3 Parallel Operation
      4. 6.3.4 Current Regulation
      5. 6.3.5 Current Recirculation and Decay Modes
      6. 6.3.6 Protection Circuits
        1. 6.3.6.1 OCP
        2. 6.3.6.2 TSD
        3. 6.3.6.3 UVLO
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Current Regulation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance Sizing
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
    6. 8.6 Community Resources
    7. 8.7 Trademarks
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) DRV8848 UNIT
PWP (HTSSOP)
16 PINS
RθJA Junction-to-ambient thermal resistance 40.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.7 °C/W
RθJB Junction-to-board thermal resistance 28.7 °C/W
ΨJT Junction-to-top characterization parameter 0.6 °C/W
ΨJB Junction-to-board characterization parameter 11.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.