SLVSCC0D November   2013  – October 2019 DRV8850

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supervisor
      2. 7.3.2 Bridge Control
      3. 7.3.3 Current Sensing – VPROPI
      4. 7.3.4 Slew-Rate Control
      5. 7.3.5 Dead Time
      6. 7.3.6 Propagation Delay
      7. 7.3.7 Power Supplies and Input Pins
      8. 7.3.8 LDO Voltage Regulator
      9. 7.3.9 Protection Circuits
        1. 7.3.9.1 Overcurrent Protection (OCP)
        2. 7.3.9.2 Thermal Shutdown (TSD)
        3. 7.3.9.3 Undervoltage Lockout (UVLO)
        4. 7.3.9.4 Overvoltage Lockout (OVLO)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Motor Voltage
        2. 8.2.2.2 Drive Current
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.7 Power Supplies and Input Pins

An internal charge pump generates a voltage greater than VCC that is used to drive the internal N-channel power MOSFETs. The charge pump requires a capacitor between the VCP and VCC pins. TI recommends bypassing VCC to ground with 0.1-μF and 10-μF ceramic capacitors, placing them as close as possible to the IC. Each input pin has a weak pulldown resistor to ground (see Electrical Characteristics for more details).

The input pins should not be driven to more than 0.6 V without the VCC power supply removed.