SLVSCC0D November 2013 – October 2019 DRV8850
PRODUCTION DATA.
THERMAL METRIC(1) | DRV8850 | UNIT | |
---|---|---|---|
RGY (VQFN) | |||
24 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 39.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 41.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 15 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 14.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.2 | °C/W |