SLRS065E September   2013  – November 2015 DRV8860

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Recommended Output Current
      2. 8.3.2 Daisy Chain Connection
      3. 8.3.3 Protection Circuits
        1. 8.3.3.1 Overcurrent Protection (OCP)
        2. 8.3.3.2 Open Load Detection (OL) - DRV8860 only
        3. 8.3.3.3 Thermal Shutdown (TSD)
        4. 8.3.3.4 Undervoltage Lockout (UVLO)
        5. 8.3.3.5 Digital Noise Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 Internal Registers
    5. 8.5 Programming
      1. 8.5.1 Serial Control Interface
        1. 8.5.1.1 Data Writing Waveform
        2. 8.5.1.2 Fault Register Reading Waveform
        3. 8.5.1.3 Special Command
          1. 8.5.1.3.1 Special command: Write Control Register
          2. 8.5.1.3.2 Special command: Read Control Register
          3. 8.5.1.3.3 Special command: Read Data Register
          4. 8.5.1.3.4 Special command: Fault Register Reset
          5. 8.5.1.3.5 Special command: PWM Start
        4. 8.5.1.4 Output Energizing and PWM Control
          1. 8.5.1.4.1 PWM Start Special Command Used
    6. 8.6 Register Maps
      1. 8.6.1 Data Register
      2. 8.6.2 Fault Register
      3. 8.6.3 Control Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Drive Current
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply and Logic Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Consideration
      1. 11.3.1 Power Dissipation
      2. 11.3.2 Heatsinking
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.