SLVSCY8B August 2015 – July 2016 DRV8870
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
The DRV8870 device has thermal shutdown (TSD) as described in the Thermal Shutdown (TSD) section. If the die temperature exceeds approximately 175°C, the device is disabled until the temperature drops below the temperature hysteresis level.
Any tendency of the device to enter TSD is an indication of either excessive power dissipation, insufficient heatsinking, or too high of an ambient temperature.