SLVSCY8B August 2015 – July 2016 DRV8870
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | DRV8870 | UNIT | |
---|---|---|---|
DDA (HSOP) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 41.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 53.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 23.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 8.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 23 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.7 | °C/W |