SLVSDY7B
October 2017 – January 2021
DRV8873-Q1
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
SPI Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Bridge Control
7.3.1.1
Control Modes
7.3.1.2
Half-Bridge Operation
7.3.1.3
22
7.3.1.4
Internal Current Sense and Current Regulation
7.3.1.5
Slew-Rate Control
7.3.1.6
Dead Time
7.3.1.7
Propagation Delay
7.3.1.8
nFAULT Pin
7.3.1.9
nSLEEP as SDO Reference
7.3.2
Motor Driver Protection Circuits
7.3.2.1
VM Undervoltage Lockout (UVLO)
7.3.2.2
VCP Undervoltage Lockout (CPUV)
7.3.2.3
Overcurrent Protection (OCP)
7.3.2.3.1
Latched Shutdown (OCP_MODE = 00b)
7.3.2.3.2
Automatic Retry (OCP_MODE = 01b)
7.3.2.3.3
Report Only (OCP_MODE = 10b)
7.3.2.3.4
Disabled (OCP_MODE = 11b)
7.3.2.4
Open-Load Detection (OLD)
7.3.2.4.1
Open-Load Detection in Passive Mode (OLP)
7.3.2.4.2
Open-Load Detection in Active Mode (OLA)
7.3.2.5
Thermal Shutdown (TSD)
7.3.2.5.1
Latched Shutdown (TSD_MODE = 0b)
7.3.2.5.2
Automatic Recovery (TSD_MODE = 1b)
7.3.2.6
Thermal Warning (OTW)
7.3.3
Hardware Interface
7.3.3.1
MODE (Tri-Level Input)
7.3.3.2
Slew Rate
7.4
Device Functional Modes
7.4.1
Motor Driver Functional Modes
7.4.1.1
Sleep Mode (nSLEEP = 0)
7.4.1.2
Disable Mode (nSLEEP = 1, DISABLE = 1)
7.4.1.3
Operating Mode (nSLEEP = 1, DISABLE = 0)
7.4.1.4
nSLEEP Reset Pulse
7.5
Programming
7.5.1
Serial Peripheral Interface (SPI) Communication
7.5.1.1
SPI Format
7.5.1.2
SPI for a Single Slave Device
7.5.1.3
SPI for Multiple Slave Devices in Parallel Configuration
7.5.1.4
SPI for Multiple Slave Devices in Daisy Chain Configuration
7.6
Register Maps
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Motor Voltage
8.2.1.2
Drive Current and Power Dissipation
8.2.1.3
Sense Resistor
8.2.2
Detailed Design Procedure
8.2.2.1
Thermal Considerations
8.2.2.2
Heatsinking
8.2.3
Application Curves
9
Power Supply Recommendations
9.1
Bulk Capacitance Sizing
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
PWP|24
MPDS372A
Thermal pad, mechanical data (Package|Pins)
PWP|24
PPTD264C
Orderable Information
slvsdy7b_oa
slvsdy7b_pm
6.7
Typical Characteristics
Figure 6-2
R
DS(on)
vs Temperature
Figure 6-4
Sleep Current (I
VM(Q)
) vs Temperature
ITRIP = 10b
Figure 6-6
ITRIP Current vs Temperature
Figure 6-3
Operating Current (I
VM
) vs Temperature
ITRIP = 01b
Figure 6-5
ITRIP Current vs Temperature
ITRIP = 11b
Figure 6-7
ITRIP Current vs Temperature