SLVSDY7B October   2017  – January 2021 DRV8873-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bridge Control
        1. 7.3.1.1 Control Modes
        2. 7.3.1.2 Half-Bridge Operation
        3. 7.3.1.3 22
        4. 7.3.1.4 Internal Current Sense and Current Regulation
        5. 7.3.1.5 Slew-Rate Control
        6. 7.3.1.6 Dead Time
        7. 7.3.1.7 Propagation Delay
        8. 7.3.1.8 nFAULT Pin
        9. 7.3.1.9 nSLEEP as SDO Reference
      2. 7.3.2 Motor Driver Protection Circuits
        1. 7.3.2.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.2.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.2.3 Overcurrent Protection (OCP)
          1. 7.3.2.3.1 Latched Shutdown (OCP_MODE = 00b)
          2. 7.3.2.3.2 Automatic Retry (OCP_MODE = 01b)
          3. 7.3.2.3.3 Report Only (OCP_MODE = 10b)
          4. 7.3.2.3.4 Disabled (OCP_MODE = 11b)
        4. 7.3.2.4 Open-Load Detection (OLD)
          1. 7.3.2.4.1 Open-Load Detection in Passive Mode (OLP)
          2. 7.3.2.4.2 Open-Load Detection in Active Mode (OLA)
        5. 7.3.2.5 Thermal Shutdown (TSD)
          1. 7.3.2.5.1 Latched Shutdown (TSD_MODE = 0b)
          2. 7.3.2.5.2 Automatic Recovery (TSD_MODE = 1b)
        6. 7.3.2.6 Thermal Warning (OTW)
      3. 7.3.3 Hardware Interface
        1. 7.3.3.1 MODE (Tri-Level Input)
        2. 7.3.3.2 Slew Rate
    4. 7.4 Device Functional Modes
      1. 7.4.1 Motor Driver Functional Modes
        1. 7.4.1.1 Sleep Mode (nSLEEP = 0)
        2. 7.4.1.2 Disable Mode (nSLEEP = 1, DISABLE = 1)
        3. 7.4.1.3 Operating Mode (nSLEEP = 1, DISABLE = 0)
        4. 7.4.1.4 nSLEEP Reset Pulse
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI) Communication
        1. 7.5.1.1 SPI Format
        2. 7.5.1.2 SPI for a Single Slave Device
        3. 7.5.1.3 SPI for Multiple Slave Devices in Parallel Configuration
        4. 7.5.1.4 SPI for Multiple Slave Devices in Daisy Chain Configuration
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Motor Voltage
        2. 8.2.1.2 Drive Current and Power Dissipation
        3. 8.2.1.3 Sense Resistor
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Thermal Considerations
        2. 8.2.2.2 Heatsinking
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.2 Heatsinking

The PowerPAD package uses an exposed pad to remove heat from the device. For proper operation, this pad must be thermally connected to copper on the PCB to dissipate heat. On a multi-layer PCB with a ground plane, this connection can be accomplished by adding a number of vias to connect the thermal pad to the ground plane.

On PCBs without internal planes, a copper area can be added on either side of the PCB to dissipate heat. If the copper area is on the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and bottom layers.

For details about how to design the PCB, refer to the PowerPAD™ Thermally Enhanced Package application report, and the PowerPAD™ Made Easy application report, available at www.ti.com. In general, the more copper area that can be provided, the more power can be dissipated.