SLVSDO1C January   2017  – March 2020 DRV8886AT

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Indexer Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 rms Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Current Regulation
      5. 7.3.5  Controlling RREF With an MCU DAC
        1. 7.3.5.1 Various Sources of Error
          1. 7.3.5.1.1 VRREF, ARREF, and RREF Error
          2. 7.3.5.1.2 VDAC Error
        2. 7.3.5.2 Application-Specific Error Calculations
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Mode 1: Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        2. 7.3.6.2 Mode 2: Mixed Decay for Increasing and Decreasing Current
        3. 7.3.6.3 Mode 3: Smart Tune Ripple Control
        4. 7.3.6.4 Mode 4: Smart Tune Dynamic Decay
      7. 7.3.7  Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  Linear Voltage Regulators
      10. 7.3.10 Logic and Multi-Level Pin Diagrams
      11. 7.3.11 Protection Circuits
        1. 7.3.11.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.11.3 Overcurrent Protection (OCP)
        4. 7.3.11.4 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Various Sources of Error

When performing a design error calculation, the different variables that contribute the most to the error must be considered. To do so, first consider the typical values extracted from DRV8885 data sheet which are listed in Table 6 with a 20-kΩ 1% resistor .

Table 6. DRV8885 Data Sheet Values

Parameter Minimum Typical Maximum
ARREF 28100 30000 31900
VRREF 1.18 1.232 1.28
RREF 19800 20000 20200

Using and knowing the desired output current, the VDAC value can be obtained. For example, the DRV8885EVM, which has a 20-kΩ resistor for RREF, was selected to operate at a 1-A, 400mA, and 200 mA current. Table 7 lists the calculated VDAC values using typical ARREF and VRREF data sheet values

Table 7. VDAC Calculation

Parameter Minimum Typical Maximum
IFS 1 0.4 0.2
ARREF 30 000 30 000 30 000
VRREF 1.232 1.232 1.232
RREF 20 000 20 000 20 000
VDAC 0.4107 0.9035 1.0677

Next, use Equation 3 and Equation 4 to calculate the worst case value for the minimum and maximum full scale current, respectively.

Equation 3. DRV8886AT slva872-equation-3.gif
Equation 4. DRV8886AT slva872-equation-4.gif

These two equations show that error contributions come from VDAC, ARREF, VRREF, and RREF. The next sections will show how these different error contributors, affect the overall IFS error and how they can be improved.