SLVSEE8B
November 2019 – May 2021
DRV8899-Q1
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
SPI Timing Requirements
6.7
Indexer Timing Requirements
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Stepper Motor Driver Current Ratings
7.3.1.1
Peak Current Rating
7.3.1.2
rms Current Rating
7.3.1.3
Full-Scale Current Rating
7.3.2
PWM Motor Drivers
7.3.3
Microstepping Indexer
7.3.4
Controlling VREF with an MCU DAC
7.3.5
Current Regulation
7.3.6
Decay Modes
7.3.6.1
Slow Decay for Increasing and Decreasing Current
7.3.6.2
Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
7.3.6.3
Mode 4: Slow Decay for Increasing Current, Fast Decay for Decreasing current
7.3.6.4
Mixed Decay for Increasing and Decreasing Current
7.3.6.5
Smart tune Dynamic Decay
7.3.6.6
Smart tune Ripple Control
7.3.7
Blanking Time
7.3.8
Charge Pump
7.3.9
Linear Voltage Regulators
7.3.10
Logic Level Pin Diagrams
7.3.10.1
nFAULT Pin
7.3.11
Protection Circuits
7.3.11.1
VM Undervoltage Lockout (UVLO)
7.3.11.2
VCP Undervoltage Lockout (CPUV)
7.3.11.3
Overcurrent Protection (OCP)
7.3.11.3.1
Latched Shutdown (OCP_MODE = 0b)
7.3.11.3.2
Automatic Retry (OCP_MODE = 1b)
7.3.11.4
Open-Load Detection (OL)
7.3.11.5
Thermal Shutdown (OTSD)
7.3.11.5.1
Latched Shutdown (OTSD_MODE = 0b)
7.3.11.5.2
Automatic Recovery (OTSD_MODE = 1b)
7.3.11.6
Overtemperature Warning (OTW)
7.3.11.7
Undertemperature Warning (UTW)
52
7.4
Device Functional Modes
7.4.1
Sleep Mode (nSLEEP = 0)
7.4.2
Disable Mode (nSLEEP = 1, DRVOFF = 1)
7.4.3
Operating Mode (nSLEEP = 1, DRVOFF = 0)
7.4.4
nSLEEP Reset Pulse
58
7.5
Programming
7.5.1
Serial Peripheral Interface (SPI) Communication
7.5.1.1
SPI Format
7.5.1.2
SPI for a Single Slave Device
7.5.1.3
SPI for Multiple Slave Devices in Parallel Configuration
7.5.1.4
SPI for Multiple Slave Devices in Daisy Chain Configuration
7.6
Register Maps
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Stepper Motor Speed
8.2.2.2
Current Regulation
8.2.2.3
Decay Modes
8.2.3
Application Curves
8.2.4
Thermal Application
8.2.4.1
Power Dissipation
8.2.4.1.1
Conduction Loss
8.2.4.1.2
Switching Loss
8.2.4.1.3
Power Dissipation Due to Quiescent Current
8.2.4.1.4
Total Power Dissipation
8.2.4.2
PCB Types
8.2.4.3
Thermal Parameters for HTSSOP Package
8.2.4.4
Thermal Parameters for VQFN Package
8.2.4.5
Device Junction Temperature Estimation
9
Power Supply Recommendations
9.1
Bulk Capacitance
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGE|24
MPQF124G
Thermal pad, mechanical data (Package|Pins)
RGE|24
QFND723
Orderable Information
slvsee8b_oa
slvsee8b_pm
10
Layout