SLVSEE8B November 2019 – May 2021 DRV8899-Q1
PRODUCTION DATA
THERMAL METRIC 1 | DRV8899-Q1 | UNIT | ||
---|---|---|---|---|
RGE (VQFN) | ||||
24 PINS | ||||
RθJA | Junction-to-ambient thermal resistance | 40.7 | °C/W | |
RθJC(top) | Junction-to-case (top) thermal resistance | 31.1 | °C/W | |
RθJB | Junction-to-board thermal resistance | 17.9 | °C/W | |
ψJT | Junction-to-top characterization parameter | 0.6 | °C/W | |
ψJB | Junction-to-board characterization parameter | 17.8 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.3 | °C/W |