SLVSEC9C September 2019 – February 2020 DRV8904-Q1 , DRV8906-Q1 , DRV8908-Q1 , DRV8910-Q1 , DRV8912-Q1
PRODUCTION DATA.
This section presents the variation of transient thermal parameters such as the ZθJA (Transient Junction-to-Ambient Thermal Resistance) and ZΨJB (Transient Junction-to-Board Characterization Parameter) with time for 4-layer PCB board with different copper pad area.
Figure 156, Figure 157 and Figure 158 shows the transient junction-to-ambient thermal resistance (ZθJA) vs time for 4-Layer PCB with copper-pad area of 4-cm2, 8-cm2 and 16-cm2 respectively.
Figure 159, Figure 160 and Figure 161 shows the transient junction-to-ambient thermal resistance (ZΨJB) vs time for 4-Layer PCB with copper-pad area of 4-cm2, 8-cm2 and 16-cm2 respectively.