SNLS348E October   2011  – January 2015 DS100BR210

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics — Serial Management Bus Interface
    7. 7.7 Timing Requirements — LOS and ENABLE / DISABLE Timing
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 4-Level Input Configuration Guidelines
      2. 8.3.2 Typical 4-Level Input Thresholds
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Control Mode
      2. 8.4.2 SMBus Slave Mode
      3. 8.4.3 SMBus Master Mode
      4. 8.4.4 Signal Conditioning Settings
    5. 8.5 Programming
      1. 8.5.1 System Management Bus (SMBus) and Configuration Registers
      2. 8.5.2 Transfer Of Data Via the SMBus
      3. 8.5.3 SMBus Transactions
      4. 8.5.4 Writing a Register
      5. 8.5.5 Reading a Register
      6. 8.5.6 EEPROM Programming
        1. 8.5.6.1 Master EEPROM Programming
        2. 8.5.6.2 EEPROM Address Mapping
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Signal Integrity in 10G-KR Applications
      2. 9.1.2 OOB (Out-of-Band) Functionality in SAS/SATA Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
        1. 9.2.3.1 Equalization Results (Pre-Channel Only)
        2. 9.2.3.2 Equalization and De-Emphasis Results (Pre-channel and Post-channel, No Tx Source De-emphasis)
        3. 9.2.3.3 Equalization and De-Emphasis Results (Pre-channel and Post-channel, -6 dB Tx Source De-emphasis)
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V or 2.5-V Supply Mode Operation
    2. 10.2 Power Supply Bypass
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from D Revision (April 2013) to E Revision

  • Added, updated, or renamed the following sections: Device Information Table, Application and Implementation; Power Supply Recommendations; Layout; Device and Documentation Support; Mechanical, Packaging, and Ordering InformationGo
  • Added Thermal Information Go