SNLS397D October   2011  – April 2015 DS110DF410

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Data Path Operation
      2. 8.3.2 Signal Detect
      3. 8.3.3 CTLE
      4. 8.3.4 DFE
      5. 8.3.5 Clock and Data Recovery
      6. 8.3.6 Output Driver
      7. 8.3.7 Device Configuration
        1. 8.3.7.1 Rate and Subrate Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 SMBus Master Mode and SMBus Slave Mode
      2. 8.4.2 Address Lines <ADDR_[3:0]>
      3. 8.4.3 SDA and SDC
      4. 8.4.4 Standards-Based Modes
        1. 8.4.4.1 Ref_mode 3 Mode (Reference Clock Required)
        2. 8.4.4.2 False Lock Detector Setting
        3. 8.4.4.3 Reference Clock In
        4. 8.4.4.4 Reference Clock Out
        5. 8.4.4.5 Driver Output Voltage
        6. 8.4.4.6 Driver Output De-Emphasis
        7. 8.4.4.7 Driver Output Rise/Fall Time
        8. 8.4.4.8 INT
        9. 8.4.4.9 LOCK_3, LOCK_2, LOCK_1, and LOCK_0
    5. 8.5 Programming
      1. 8.5.1  SMBus Strap Observation
      2. 8.5.2  Device Revision and Device ID
      3. 8.5.3  Control/Shared Register Reset
      4. 8.5.4  Interrupt Channel Flag Bits
      5. 8.5.5  SMBus Master Mode Control Bits
      6. 8.5.6  Resetting Individual Channels of the Retimer
      7. 8.5.7  Interrupt Status
      8. 8.5.8  Overriding the CTLE Boost Setting
      9. 8.5.9  Overriding the VCO Search Values
      10. 8.5.10 Overriding the Output Multiplexer
      11. 8.5.11 Overriding the VCO Divider Selection
      12. 8.5.12 Using the PRBS Generator
      13. 8.5.13 Using the Internal Eye Opening Monitor
      14. 8.5.14 Overriding the DFE Tap Weights and Polarities
      15. 8.5.15 Enabling Slow Rise/Fall Time on the Output Driver
      16. 8.5.16 Inverting the Output Polarity
      17. 8.5.17 Overriding the Figure of Merit for Adaptation
      18. 8.5.18 Setting the Rate and Subrate for Lock Acquisition
      19. 8.5.19 Setting the Adaptation/Lock Mode
      20. 8.5.20 Initiating Adaptation
      21. 8.5.21 Setting the Reference Enable Mode
      22. 8.5.22 Overriding the CTLE Settings Used for CTLE Adaptation
      23. 8.5.23 Setting the Output Differential Voltage
      24. 8.5.24 Setting the Output De-Emphasis Setting
    6. 8.6 Register Maps
      1. 8.6.1 Register Information
      2. 8.6.2 Bit Fields in the Register Set
      3. 8.6.3 Writing to and Reading from the Control/Shared Registers
      4. 8.6.4 Channel Select Register
      5. 8.6.5 Reading to and Writing from the Channel Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation see Absolute Maximum Ratings for Soldering, SNOA549.

For a specification of the SMBus and description of its operation, see smbus.org/specs/.

12.3 Trademarks

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.