SNLS419D July   2012  – May 2015 DS125BR401

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application
  5. 5 Revision History
  6. 6 Description (continued)
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Electrical Characteristics — Serial Management Bus Interface
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Typical 4-Level Input Thresholds
    4. 9.4 Device Functional Modes
      1. 9.4.1 Pin Control Mode
      2. 9.4.2 SMBUS Mode
    5. 9.5 Programming
      1. 9.5.1 PCIe Signal Integrity
        1. 9.5.1.1 RX-Detect in SAS/SATA (up to 6 Gbps) Applications
          1. 9.5.1.1.1 Signal Detect Control for Datarates Above 8 Gbps
        2. 9.5.1.2 MODE Operation With SMBus Registers
      2. 9.5.2 SMBUS Master Mode
      3. 9.5.3 System Management Bus (SMBus) and Configuration Registers
        1. 9.5.3.1 Transfer of Data Through the SMBus
        2. 9.5.3.2 SMBus Transactions
        3. 9.5.3.3 Writing a Register
        4. 9.5.3.4 Reading a Register
    6. 9.6 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 3.3-V or 2.5-V Supply Mode Operation
    2. 11.2 Power Supply Bypassing
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Layout Considerations for Differential Pairs
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

  • Leadless Leadframe Package (LLP) Application Report (SNOA401)
  • Absolute Maximum Ratings for Soldering (SNOA549)

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.