SNLS419D July   2012  – May 2015 DS125BR401

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Typical Application
  5. Revision History
  6. Description (continued)
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Electrical Characteristics — Serial Management Bus Interface
    7. 8.7 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Typical 4-Level Input Thresholds
    4. 9.4 Device Functional Modes
      1. 9.4.1 Pin Control Mode
      2. 9.4.2 SMBUS Mode
    5. 9.5 Programming
      1. 9.5.1 PCIe Signal Integrity
        1. 9.5.1.1 RX-Detect in SAS/SATA (up to 6 Gbps) Applications
          1. 9.5.1.1.1 Signal Detect Control for Datarates Above 8 Gbps
        2. 9.5.1.2 MODE Operation With SMBus Registers
      2. 9.5.2 SMBUS Master Mode
      3. 9.5.3 System Management Bus (SMBus) and Configuration Registers
        1. 9.5.3.1 Transfer of Data Through the SMBus
        2. 9.5.3.2 SMBus Transactions
        3. 9.5.3.3 Writing a Register
        4. 9.5.3.4 Reading a Register
    6. 9.6 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 3.3-V or 2.5-V Supply Mode Operation
    2. 11.2 Power Supply Bypassing
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Layout Considerations for Differential Pairs
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from C Revision (April 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo