SNLS491B July   2014  – February 2015 DS125BR820

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics — Serial Bus Interface DC Specifications
    7. 6.7 Serial Bus Interface Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Functional Datapath Blocks
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pin Control Mode:
      2. 7.4.2 Slave SMBus Mode:
      3. 7.4.3 SMBus Master Mode
    5. 7.5 Signal Conditioning Settings
    6. 7.6 Programming
      1. 7.6.1 EEPROM Register Map for Single Device
    7. 7.7 Register Maps
      1. 7.7.1 Transfer Of Data Via The SMBus
      2. 7.7.2 SMBus Transactions
      3. 7.7.3 Writing a Register
      4. 7.7.4 Reading a Register
      5. 7.7.5 Detailed Register Map
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Signal Integrity in 40G-CR4/KR4/SAS/SATA/PCIe Applications
      2. 8.1.2 Signal Integrity in 40G-SR4/LR4 Applications
      3. 8.1.3 Rx Detect Functionality in 40G-CR4/KR4/SAS/SATA Applications
    2. 8.2 Typical Applications
      1. 8.2.1 Generic High Speed Repeater
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots
      2. 8.2.2 Front Port Applications (40G-CR4/SR4/LR4)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Performance Plots
      3. 8.2.3 PCIe Board Applications (PCIe Gen-3)
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Design Procedure
        3. 8.2.3.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (September 2014) to B Revision

  • Added data type for all differential high speed I/O Go
  • Changed pin assignment numbers for OUTB_2+/- and OUTB_3+/- to correct typoGo
  • Changed ENSMB pin type to 4-level LVCMOS per input pin behaviorGo
  • Changed Handling Ratings table to ESD Ratings table Go
  • Changed register map rows to combine multiple consecutive registers with a value of all zeros and no EEPROM-relevant bitsGo

Changes from * Revision (July 2014) to A Revision

  • Added release of the full document Go