SNLS459A APRIL 2013 – October 2015 DS125RT410
PRODUCTION DATA.
PIN | I/O, TYPE (1) | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
HIGH-SPEED DIFFERENTIAL I/O | |||
RXP0 RXN0 |
1 2 |
I, CML | Inverting and non-inverting CML-compatible differential inputs to the equalizer. Nominal differential input impedance = 100 Ω. |
RXP1 RXN1 |
4 5 |
I, CML | Inverting and non-inverting CML-compatible differential inputs to the equalizer. Nominal differential input impedance = 100 Ω. |
RXP2 RXN2 |
8 9 |
I, CML | Inverting and non-inverting CML-compatible differential inputs to the equalizer. Nominal differential input impedance = 100 Ω. |
RXP3 RXN3 |
11 12 |
I, CML | Inverting and non-inverting CML-compatible differential inputs to the equalizer. Nominal differential input impedance = 100 Ω. |
TXP0 TXN0 |
36 35 |
O, CML | Inverting and non-inverting CML-compatible differential outputs from the driver. Nominal differential output impedance = 100 Ω. |
TXP1 TXN1 |
33 32 |
O, CML | Inverting and non-inverting CML-compatible differential outputs from the driver. Nominal differential output impedance = 100 Ω. |
TXP2 TXN2 |
29 28 |
O, CML | Inverting and non-inverting CML-compatible differential outputs from the driver. Nominal differential output impedance = 100 Ω. |
TXP3 TXN3 |
26 25 |
O, CML | Inverting and non-inverting CML-compatible differential outputs from the driver. Nominal differential output impedance = 100 Ω. |
LOOP FILTER CONNECTION PINS | |||
LPF_CP_0 LPF_REF_0 |
47 48 |
I/O, analog | Loop filter connection Place a 22 nF ± 10% capacitor between LPF_CP_0 and LPF_REF_0 |
LPF_CP_1 LPF_REF_1 |
38 37 |
I/O, analog | Loop filter connection Place a 22 nF ± 10% capacitor between LPF_CP_1 and LPF_REF_1 |
LPF_CP_2 LPF_REF_2 |
23 24 |
I/O, analog | Loop filter connection Place a 22 nF ± 10% capacitor between LPF_CP_2 and LPF_REF_2 |
LPF_CP_3 LPF_REF_3 |
14 13 |
I/O, analog | Loop filter connection Place a 22 nF ± 10% capacitor between LPF_CP_3 and LPF_REF_3 |
REFERENCE CLOCK I/O | |||
REFCLK_IN | 19 | I, 2.5-V analog | Input is 2.5 V, 25 MHz ± 100-ppm reference clock from external oscillator No stringent phase noise requirement |
REFCLK_OUT | 42 | O, 2.5-V analog | Output is 2.5 V, buffered replica of reference clock input for connecting multiple DS125RT410 devices on a board |
LOCK INDICATOR PINS | |||
LOCK0 LOCK1 LOCK2 LOCK3 |
45 40 21 16 |
O, 2.5-V LVCMOS | Output is 2.5 V, the pin is high when CDR lock is attained on the corresponding channel. These pins are shared with SMBus address strap input functions read at start-up. |
SMBus MASTER MODE PINS | |||
ALL_DONE | 41 | O, 2.5-V LVCMOS | Output is 2.5 V, the pin goes low to indicate that the SMBus master EEPROM read has been completed. |
READ_EN | 44 | I, 2.5-V LVCMOS | Input is 2.5 V, a transition from high to low starts the load from the external EEPROM. The READ_EN pin must be tied low when in SMBus slave mode. |
INTERRUPT OUTPUT | |||
INT | 43 | O, 3.3-V LVCMOS, Open Drain |
Used to signal horizontal or vertical eye opening out of tolerance, loss of signal detect, or CDR unlock. External 2-kΩ to 5-kΩ pullup resistor is required. Pin is 3.3-V LVCMOS tolerant. |
SERIAL MANAGEMENT BUS (SMBus) INTERFACE | |||
EN_SMB | 20 | I, 2.5-V analog | Input is 2.5 V, selects SMBus master mode or SMBus slave mode. EN_SMB = High for slave mode EN_SMB = Float for master mode Tie READ_EN pin low for SMBus slave mode. See Table 4. |
SDA | 18 | I/O, 3.3-V LVCMOS, Open Drain |
Data Input and Open Drain Output External 2-kΩ to 5-kΩ pullup resistor is required. Pin is 3.3-V LVCMOS tolerant. |
SDC | 17 | I/O, 3.3-V LVCMOS, Open Drain |
Clock Input and Open Drain Clock Output External 2-kΩ to 5-kΩ pullup resistor is required. Pin is 3.3-V LVCMOS tolerant. |
ADDR_0 ADDR_1 ADDR_2 ADDR_3 |
45 40 21 16 |
I, 2.5-V LVCMOS | Input is 2.5 V, the ADDR_[3:0] pins set the SMBus address for the retimer. These pins are strap inputs. Their state is read on power-up to set the SMBus address in SMBus control mode. High = 1 kΩ to VDD, Low = 1 kΩ to GND These pins are shared with the lock indicator functions. See Table 1. |
POWER | |||
VDD | 3, 6, 7, 10, 15, 46 |
Power | VDD = 2.5 V ± 5% |
GND | 22, 27, 30, 31, 34, 39 |
Power | Ground reference. |
DAP | PAD | Power | Ground reference. The exposed pad at the center of the package must be connected to ground plane of the board with at least 4 vias to lower the ground impedance and improve the thermal performance of the package. |