SNLS732
February 2023
DS160PR1601
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD and Latchup Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
DC Electrical Characteristics
6.6
High Speed Electrical Characteristics
6.7
SMBUS/I2C Timing Charateristics
6.8
Typical Characteristics
6.9
Typical Jitter Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Control and Configuration Interface
7.3.1
Pin Configurations for Lanes
7.3.1.1
Five-Level Control Inputs
7.3.2
SMBUS/I2C Register Control Interface
7.3.3
SMBus/I 2 C Primary Mode Configuration (EEPROM Self Load)
7.4
Feature Description
7.4.1
Linear Equalization
7.4.2
Flat-Gain
7.4.3
Analog EyeScan
7.4.4
Receiver Detect State Machine
7.4.5
Integrated Capacitors
7.5
Device Functional Modes
7.5.1
Active PCIe Mode
7.5.2
Active Buffer Mode
7.5.3
Standby Mode
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
PCIe x16 Lane Configuration
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
ZDG|354
MPBGAV1C
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snls732_oa
snls732_pm
9.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.