SNLS732 February   2023 DS160PR1601

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD and Latchup Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 High Speed Electrical Characteristics
    7. 6.7 SMBUS/I2C Timing Charateristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Jitter Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Control and Configuration Interface
      1. 7.3.1 Pin Configurations for Lanes
        1. 7.3.1.1 Five-Level Control Inputs
      2. 7.3.2 SMBUS/I2C Register Control Interface
      3. 7.3.3 SMBus/I 2 C Primary Mode Configuration (EEPROM Self Load)
    4. 7.4 Feature Description
      1. 7.4.1 Linear Equalization
      2. 7.4.2 Flat-Gain
      3. 7.4.3 Analog EyeScan
      4. 7.4.4 Receiver Detect State Machine
      5. 7.4.5 Integrated Capacitors
    5. 7.5 Device Functional Modes
      1. 7.5.1 Active PCIe Mode
      2. 7.5.2 Active Buffer Mode
      3. 7.5.3 Standby Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 PCIe x16 Lane Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage, VCC to GND DC plus AC power should not exceed these limits 3.0 3.3 3.6 V
NVCC Supply noise tolerance DC to <50 Hz, sinusoidal1 250 mVpp
50 Hz to 500 kHz, sinusoidal1 100 mVpp
500 kHz to 2.5 MHz, sinusoidal1 33 mVpp
Supply noise, >2.5 MHz, sinusoidal1 10 mVpp
TRampVCC VCC supply ramp time From 0 V to 3.0 V 0.150 100 ms
TJ Operating junction temperature –40 120 °C
PWLVCMOS Minimum pulse width required for the device to detect a valid signal on LVCMOS inputs PD1/0, and READ_EN_N 200 μs
VCCSMBUS SMBus/I2C SDA and SCL Open Drain Termination Voltage Supply voltage for open drain pull-up resistor 3.6 V
FSMBus SMBus/I2C clock (SCL) frequency in secondary mode 10 400 kHz
VIDLAUNCH Source differential launch amplitude 800 1200 mVpp
DR Data rate 1 16 Gbps