SNLS732 February   2023 DS160PR1601

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD and Latchup Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 High Speed Electrical Characteristics
    7. 6.7 SMBUS/I2C Timing Charateristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Jitter Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Control and Configuration Interface
      1. 7.3.1 Pin Configurations for Lanes
        1. 7.3.1.1 Five-Level Control Inputs
      2. 7.3.2 SMBUS/I2C Register Control Interface
      3. 7.3.3 SMBus/I 2 C Primary Mode Configuration (EEPROM Self Load)
    4. 7.4 Feature Description
      1. 7.4.1 Linear Equalization
      2. 7.4.2 Flat-Gain
      3. 7.4.3 Analog EyeScan
      4. 7.4.4 Receiver Detect State Machine
      5. 7.4.5 Integrated Capacitors
    5. 7.5 Device Functional Modes
      1. 7.5.1 Active PCIe Mode
      2. 7.5.2 Active Buffer Mode
      3. 7.5.3 Standby Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 PCIe x16 Lane Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 SMBUS/I2C Timing Charateristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Secondary Mode
tSP Pulse width of spikes which must be
suppressed by the input filter		 50 ns
tHD-STA Hold time (repeated) START condition.
After this period, the first clock pulse is
generated		 0.6 µs
tLOW LOW period of the SCL clock 1.3 µs
THIGH HIGH period of the SCL clock 0.6 µs
tSU-STA Set-up time for a repeated START
condition		 0.6 µs
tHD-DAT Data hold time 0 µs
TSU-DAT Data setup time 0.1 µs
tr Rise time of both SDA and SCL signals Pull-up resistor = 4.7 kΩ, Cb = 10pF 120 ns
tf Fall time of both SDA and SCL signals Pull-up resistor = 4.7 kΩ, Cb = 10pF 2 ns
tSU-STO Set-up time for STOP condition 0.6 µs
tBUF Bus free time between a STOP and
START condition		 1.3 µs
tVD-DAT Data valid time 0.9 µs
tVD-ACK Data valid acknowledge time 0.9 µs
Cb Capacitive load for each bus line 400 pF
Primary Mode
fSCL-M SCL clock frequency MODE = L1 (Primary Mode) 303 kHz
tLOW-M SCL low period 1.90 µs
THIGH-M SCL high period 1.40 µs
tSU-STA-M Set-up time for a repeated START
condition		 2 µs
tHD-STA-M Hold time (repeated) START condition.
After this period, the first clock pulse is
generated		 1.5 µs
TSU-DAT-M Data setup time 1.4 µs
tHD-DAT-M Data hold time 0.5 µs
tR-M Rise time of both SDA and SCL signals Pull-up resistor = 4.7 kΩ, Cb = 10pF 120 ns
TF-M Fall time of both SDA and SCL signals Pull-up resistor = 4.7 kΩ, Cb = 10pF 2 ns
tSU-STO-M Stop condition setup time 1.5 µs
EEPROM Timing
TEEPROM EEPROM configuration load time Time to assert ALL_DONE_N after READ_EN_N has been asserted. 30 ms
TPOR Time to first SMBus access Power supply stable after initial ramp. Includes initial power-on reset time. 50 ms