SNLS544B September   2016  – October 2019 DS280BR820

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics – Serial Management Bus Interface
    7. 6.7 Timing Requirements – Serial Management Bus Interface
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Data Path Operation
      2. 7.3.2 AC-Coupled Receiver Inputs
      3. 7.3.3 Signal Detect
      4. 7.3.4 2-Stage CTLE
      5. 7.3.5 Driver DC Gain Control
      6. 7.3.6 FIR Filter (Limiting Mode)
      7. 7.3.7 Configurable SMBus Address
    4. 7.4 Device Functional Modes
      1. 7.4.1 SMBus Slave Mode Configuration
      2. 7.4.2 SMBus Master Mode Configuration (EEPROM Self Load)
    5. 7.5 Programming
      1. 7.5.1 Transfer of Data with the SMBus Interface
    6. 7.6 Register Maps
      1. 7.6.1 Register Types: Global, Shared, and Channel
      2. 7.6.2 Global Registers: Channel Selection and ID Information
        1. Table 2. Global Register Map
      3. 7.6.3 Shared Registers
        1. Table 3. Shared Register Map
      4. 7.6.4 Channel Registers
        1. Table 4. Channel Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Backplane and Mid-Plane Reach Extension
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Front-Port Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Pattern Generator Characteristics
        2. 8.2.3.2 Equalizing Moderate Pre-Channel Loss
        3. 8.2.3.3 Equalizing High Pre-Channel Loss
        4. 8.2.3.4 Equalizing High Pre-Channel Loss and Moderate Post-Channel Loss
        5. 8.2.3.5 Output in FIR Limiting Mode with 16T Pattern
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Stripline Example
      2. 10.2.2 Microstrip Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC (1) CONDITIONS / ASSUMPTIONS VALUE UNIT
RθJA Junction-to-ambient thermal resistance 4-layer JEDEC board 45.2 °C/W
10-layer 8-in x 6-in board 26.3
20-layer 8-in x 6-in board 24.8
30-layer 8-in x 6-in board 22.7
RθJC(top) Junction-to-case (top) thermal resistance 4-layer JEDEC board 26.6 °C/W
RθJB Junction-to-board thermal resistance 4-layer JEDEC board 25.8 °C/W
ψJT Junction-to-top characterization parameter 4-layer JEDEC board 13.3 °C/W
10-layer 8-in x 6-in board 13.0
20-layer 8-in x 6-in board 13.0
30-layer 8-in x 6-in board 13.0
ψJB Junction-to-board characterization parameter 4-layer JEDEC board 22.8 °C/W
10-layer 8-in x 6-in board 21.4
20-layer 8-in x 6-in board 21.1
30-layer 8-in x 6-in board 20.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.