SNLS538B September   2016  – February 2024 DS280DF810

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements, Retimer Jitter Specifications
    7. 5.7  Timing Requirements, Retimer Specifications
    8. 5.8  Timing Requirements, Recommended Calibration Clock Specifications
    9. 5.9  Recommended SMBus Switching Characteristics (Target Mode)
    10. 5.10 Recommended SMBus Switching Characteristics (Controller Mode)
    11. 5.11 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Device Data Path Operation
        1. 6.3.1.1 AC-Coupled Receiver and Transmitter
        2. 6.3.1.2 Signal Detect
        3. 6.3.1.3 Continuous Time Linear Equalizer (CTLE)
        4. 6.3.1.4 Variable Gain Amplifier (VGA)
        5. 6.3.1.5 2x2 Cross-Point Switch
        6. 6.3.1.6 Decision Feedback Equalizer (DFE)
        7. 6.3.1.7 Clock and Data Recovery (CDR)
        8. 6.3.1.8 Calibration Clock
        9. 6.3.1.9 Differential Driver with FIR Filter
          1. 6.3.1.9.1 Setting the Output VOD, Pre-Cursor, and Post-Cursor Equalization
          2. 6.3.1.9.2 Output Driver Polarity Inversion
      2. 6.3.2 Debug Features
        1. 6.3.2.1 Pattern Generator
        2. 6.3.2.2 Pattern Checker
        3. 6.3.2.3 Eye Opening Monitor
        4. 6.3.2.4 Interrupt Signals
    4. 6.4 Device Functional Modes
      1. 6.4.1 Supported Data Rates
      2. 6.4.2 SMBus Controller Mode
      3. 6.4.3 42
      4. 6.4.4 Device SMBus Address
    5. 6.5 Programming
      1. 6.5.1 Bit Fields in the Register Set
      2. 6.5.2 Writing to and Reading from the Global/Shared/Channel Registers
    6. 6.6 Register Maps
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Backplane and Mid-Plane Reach Extension Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
      2. 7.2.2 Front-Port Jitter Cleaning Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABW|135
  • ABV|135
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.2 Layout Example

The following example layout demonstrates how all signals can be escaped from the BGA array using stripline routing on a generic 28-layer stackup. This example layout assumes the following:

  • Trace width: 0.127mm (5 mil)
  • Trace edge-to-edge spacing: 0.152mm (6 mil)
  • VIA finished hole size (diameter): 0.203mm (8 mil)
  • VIA drilled hole size: 0.254mm (10 mil)
  • VIA-to-VIA spacing: 1.0mm (39 mil), to enhance PCB manufacturability
  • No VIA-in-pad used

Note that many other escape routing options exist using different trace width and spacing combinations. The optimum trace width and spacing will depend on the PCB material, PCB routing density, and other factors.

GUID-E9A8B1AA-5325-4DD5-BAB0-22E5B63A06E5-low.pngFigure 7-8 Top Layer
GUID-918C508B-F2A4-4B7A-B19F-8D032ADEF167-low.pngFigure 7-10 Internal Signal Layer 2
GUID-854EE61E-0DE0-41F0-948B-24CEBE46C13E-low.pngFigure 7-9 Internal Signal Layer 1
GUID-A9291967-9BC1-4B7B-A076-BC211718CDD0-low.pngFigure 7-11 Bottom Layer