SNLS709B december   2021  – june 2023 DS560DF810

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Description (continued)
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Related Documentation
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Description (continued)

The DS560DF810 is equipped with a bit mux and de-mux gearbox for simple NRZ-to-PAM4 or PAM4-to-NRZ conversion between host and module. The gearbox is capable of aggregating a pair of NRZ inputs up to 28.9 GBd into one 28.9 GBd PAM4 output as well as de-aggregating a single 28.9 GBd PAM4 input into a pair of 28.9 GBd NRZ outputs.

The DS560DF810 implements a full 2×2 crosspoint between each pair of adjacent channels after the CDR to enable fast and flexible lane switching for PCB routing flexibility, 2-to-1 multiplexing and 1-to-2 de-multiplexing for failover redundancy, and 1-to-2 fanout for diagnostic monitoring. In addition, integrated physical AC coupling capacitors (TX and RX) eliminate the need for external capacitors on the PCB. These features reduce PCB routing complexity and bill of material (BOM) cost.

Diagnostic capabilities include a non-destructive PAM4/NRZ vertical eye height monitor, a 2D PAM4/NRZ eye opening monitor (EOM), PRBS pattern generator with error injector module, PRBS error checker, and on-die temperature sensor. These features help to gauge the margin of the link and can be used to monitor the health of the system over time.

The DS560DF810 can be configured either through I2C or through an external EEPROM. Up to 16 devices can share a single EEPROM.