SNLS733A December   2022  – October 2023 DS560MB410

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Description (Continued)
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Related Documentation
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Quad-channel multi-protocol linear equalizer supporting up to 28-GBd (PAM4) and 32-GBd (NRZ) interfaces
  • Suitable for up to CEI-56G, Ethernet (400 GbE), Fibre Channel (64GFC), InfiniBand™ (HDR), and CPRI/eCPRI PCB and copper cable applications
  • Selectable CTLE boost profiles to compensate either PCB or cable loss
  • Integrated 2×2 crosspoint with pin or register control for mux, fanout, and signal crossing
  • Low power consumption: 160 mW / channel (typical)
  • No heat sink required
  • Linear equalization with CTLE for seamless support of CR/KR link training, auto-negotiation, and FEC pass-through
  • Extends long-reach links by 18-dB+ beyond normal ASIC-to-ASIC capability at 13.28 GHz
  • Eye expander for PAM-4 eye symmetry enhancement
  • Low input-to-output latency: 80 ps (typical)
  • Low additive random jitter
  • Small 6.00 mm × 6.00 mm BGA package for easy flow-through routing
  • No reference clock required
  • Single 2.5-V ± 5% power supply
  • –40°C to +85°C ambient temperature range